Wafer-Level Chip-Scale Packaging (Record no. 51986)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 03807nam a22005535i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 978-1-4939-1556-9 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20200420220222.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 140910s2015 xxu| s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9781493915569 |
| -- | 978-1-4939-1556-9 |
| 082 04 - CLASSIFICATION NUMBER | |
| Call Number | 621.381 |
| 100 1# - AUTHOR NAME | |
| Author | Qu, Shichun. |
| 245 10 - TITLE STATEMENT | |
| Title | Wafer-Level Chip-Scale Packaging |
| Sub Title | Analog and Power Semiconductor Applications / |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | XVII, 322 p. 314 illus., 256 illus. in color. |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Remark 2 | Chapter 1. Demand and Challenges for Wafer Level Analog and Power Packaging -- Chapter 2. Fan-In Analog Wafer Level Chip Scale Package -- Chapter 3. Fan-Out Analog Wafer Level Chip Scale Package -- Chapter 4. Wafer Level Analog Chip Scale Package Stackable Design -- Chapter 5. Wafer Level Discrete Power MOSFET Package Design -- Chapter 6. Wafer Level Packaging TSV/Stack die for Integration of Analog and Power Solution -- Chapter 7. Thermal Management, Design, Analysis for WLCSP -- Chapter 8. Electrical and Multi-Physics Simulations for Analog and Power WLCSP -- Chapter 9. WLCSP Typical Assembly Process -- Chapter 10. WLCSP Typical Reliability and Test. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | This book presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability, and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials, and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical, and stress modeling methodologies is also provided. This book also: �         Covers the development of wafer-level power discrete packaging with regular wafer-level design concepts and directly bumping technology �         Introduces the development of the analog and power SIP/3D/TSV/stack die packaging technology �         Presents the wafer-level analog IC packaging design through fan-in and fan-out with RDLs. |
| 700 1# - AUTHOR 2 | |
| Author 2 | Liu, Yong. |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | http://dx.doi.org/10.1007/978-1-4939-1556-9 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | eBooks |
| 264 #1 - | |
| -- | New York, NY : |
| -- | Springer New York : |
| -- | Imprint: Springer, |
| -- | 2015. |
| 336 ## - | |
| -- | text |
| -- | txt |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | c |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | cr |
| -- | rdacarrier |
| 347 ## - | |
| -- | text file |
| -- | |
| -- | rda |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Engineering. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Thermodynamics. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Heat engineering. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Heat transfer. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Mass transfer. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronics. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Microelectronics. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronic circuits. |
| 650 14 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Engineering. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronics and Microelectronics, Instrumentation. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Circuits and Systems. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Engineering Thermodynamics, Heat and Mass Transfer. |
| 912 ## - | |
| -- | ZDB-2-ENG |
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