Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces (Record no. 53961)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 02891nam a22005295i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 978-3-662-48823-2 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20200421111203.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 151031s2016 gw | s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9783662488232 |
| -- | 978-3-662-48823-2 |
| 082 04 - CLASSIFICATION NUMBER | |
| Call Number | 620.1 |
| 100 1# - AUTHOR NAME | |
| Author | Zhang, Qingke. |
| 245 10 - TITLE STATEMENT | |
| Title | Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | XV, 143 p. 115 illus., 81 illus. in color. |
| 490 1# - SERIES STATEMENT | |
| Series statement | Springer Theses, Recognizing Outstanding Ph.D. Research, |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Remark 2 | Research Progress in Pb-free Soldering -- Fracture Behavior of IMCs at Cu/Pb-free Solder Interface -- Tensile-compress Fatigue Behavior of Solder Joints -- Shear Creep-fatigue Behavior of Cu/Pb-free Solder Joints -- Thermal Fatigue Behavior of Sn-Ag/Cu Solder Joints -- Conclusions. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| General subdivision | Surfaces. |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | http://dx.doi.org/10.1007/978-3-662-48823-2 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | eBooks |
| 264 #1 - | |
| -- | Berlin, Heidelberg : |
| -- | Springer Berlin Heidelberg : |
| -- | Imprint: Springer, |
| -- | 2016. |
| 336 ## - | |
| -- | text |
| -- | txt |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | c |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | cr |
| -- | rdacarrier |
| 347 ## - | |
| -- | text file |
| -- | |
| -- | rda |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Engineering. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Structural mechanics. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Materials science. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Materials |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Thin films. |
| 650 14 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Engineering. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Structural Mechanics. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Surfaces and Interfaces, Thin Films. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Classical Mechanics. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Characterization and Evaluation of Materials. |
| 830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE | |
| -- | 2190-5053 |
| 912 ## - | |
| -- | ZDB-2-ENG |
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