Electromigration Modeling at Circuit Layout Level (Record no. 54284)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 02838nam a22005655i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 978-981-4451-21-5 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20200421111649.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 130321s2013 si | s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9789814451215 |
| -- | 978-981-4451-21-5 |
| 082 04 - CLASSIFICATION NUMBER | |
| Call Number | 658.56 |
| 100 1# - AUTHOR NAME | |
| Author | Tan, Cher Ming. |
| 245 10 - TITLE STATEMENT | |
| Title | Electromigration Modeling at Circuit Layout Level |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | IX, 103 p. 75 illus., 2 illus. in color. |
| 490 1# - SERIES STATEMENT | |
| Series statement | SpringerBriefs in Applied Sciences and Technology, |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Remark 2 | Introduction -- 3D Circuit Model Construction and Simulation -- Comparison of EM Performance in Circuit Structure and Test Structure -- Interconnect EM Reliability Modeling at Circuit Layout Level -- Conclusion. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level. . |
| 700 1# - AUTHOR 2 | |
| Author 2 | He, Feifei. |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | http://dx.doi.org/10.1007/978-981-4451-21-5 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | eBooks |
| 264 #1 - | |
| -- | Singapore : |
| -- | Springer Singapore : |
| -- | Imprint: Springer, |
| -- | 2013. |
| 336 ## - | |
| -- | text |
| -- | txt |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | c |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | cr |
| -- | rdacarrier |
| 347 ## - | |
| -- | text file |
| -- | |
| -- | rda |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Engineering. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Atoms. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Physics. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronic circuits. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Quality control. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Reliability. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Industrial safety. |
| 650 14 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Engineering. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Quality Control, Reliability, Safety and Risk. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronic Circuits and Devices. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Atomic, Molecular, Optical and Plasma Physics. |
| 830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE | |
| -- | 2191-530X |
| 912 ## - | |
| -- | ZDB-2-ENG |
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