Fundamentals of Lead-Free Solder Interconnect Technology (Record no. 54675)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 03406nam a22005535i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 978-1-4614-9266-5 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20200421111656.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 141105s2015 xxu| s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9781461492665 |
| -- | 978-1-4614-9266-5 |
| 082 04 - CLASSIFICATION NUMBER | |
| Call Number | 621.381 |
| 100 1# - AUTHOR NAME | |
| Author | Lee, Tae-Kyu. |
| 245 10 - TITLE STATEMENT | |
| Title | Fundamentals of Lead-Free Solder Interconnect Technology |
| Sub Title | From Microstructures to Reliability / |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | XIII, 253 p. 151 illus., 81 illus. in color. |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Remark 2 | Introduction -- Interconnection : The Joint -- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys -- Microstructure Development; Solidification and Isothermal Aging -- Thermal Cycling Performance -- Mechanical Stability and Performance -- Chemical and Environment Attack -- Challenges in Future Generation Interconnects: Microstructure Again. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution. The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based. In summary, this book: Provides an up-to-date overview on lead-free soldering technologies Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering technique Explores emerging technologies in lead-free soldering. |
| 700 1# - AUTHOR 2 | |
| Author 2 | Bieler, Thomas R. |
| 700 1# - AUTHOR 2 | |
| Author 2 | Kim, Choong-Un. |
| 700 1# - AUTHOR 2 | |
| Author 2 | Ma, Hongtao. |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | http://dx.doi.org/10.1007/978-1-4614-9266-5 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | eBooks |
| 264 #1 - | |
| -- | Boston, MA : |
| -- | Springer US : |
| -- | Imprint: Springer, |
| -- | 2015. |
| 336 ## - | |
| -- | text |
| -- | txt |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | c |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | cr |
| -- | rdacarrier |
| 347 ## - | |
| -- | text file |
| -- | |
| -- | rda |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Engineering. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronics. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Microelectronics. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronic circuits. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Optical materials. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronic materials. |
| 650 14 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Engineering. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronics and Microelectronics, Instrumentation. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Optical and Electronic Materials. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Circuits and Systems. |
| 912 ## - | |
| -- | ZDB-2-ENG |
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