Electrical Design of Through Silicon Via (Record no. 55379)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 02619nam a22004815i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 978-94-017-9038-3 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20200421111838.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 140511s2014 ne | s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9789401790383 |
| -- | 978-94-017-9038-3 |
| 082 04 - CLASSIFICATION NUMBER | |
| Call Number | 621.3815 |
| 245 10 - TITLE STATEMENT | |
| Title | Electrical Design of Through Silicon Via |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | IX, 280 p. 249 illus. |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Remark 2 | Preface -- 1 Introduction -- 2 Electrical Modeling of a Through-Silicon Via (TSV) -- 3 High-speed TSV-based Channel Modeling and Design -- 4 Noise Coupling and Shielding in 3D ICs -- 5 Thermal Effects on TSV Signal Integrity -- 6 Power Distribution Network (PDN) Modeling and Analysis for TSV and Interposer-based 3D-ICs in the Frequency Domain -- 7 TSV Decoupling Schemes -- Index. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity, and even thermal integrity. Most of the analysis in this book include simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have been studied deep into a TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered. |
| 700 1# - AUTHOR 2 | |
| Author 2 | Lee, Manho. |
| 700 1# - AUTHOR 2 | |
| Author 2 | Pak, Jun So. |
| 700 1# - AUTHOR 2 | |
| Author 2 | Kim, Joungho. |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | http://dx.doi.org/10.1007/978-94-017-9038-3 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | eBooks |
| 264 #1 - | |
| -- | Dordrecht : |
| -- | Springer Netherlands : |
| -- | Imprint: Springer, |
| -- | 2014. |
| 336 ## - | |
| -- | text |
| -- | txt |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | c |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | cr |
| -- | rdacarrier |
| 347 ## - | |
| -- | text file |
| -- | |
| -- | rda |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Engineering. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Special purpose computers. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronic circuits. |
| 650 14 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Engineering. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Circuits and Systems. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronic Circuits and Devices. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Special Purpose and Application-Based Systems. |
| 912 ## - | |
| -- | ZDB-2-ENG |
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