Advanced Flip Chip Packaging (Record no. 57339)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 03218nam a22005415i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 978-1-4419-5768-9 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20200421112220.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 130321s2013 xxu| s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9781441957689 |
| -- | 978-1-4419-5768-9 |
| 082 04 - CLASSIFICATION NUMBER | |
| Call Number | 621.381 |
| 245 10 - TITLE STATEMENT | |
| Title | Advanced Flip Chip Packaging |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | VII, 560 p. 413 illus., 242 illus. in color. |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Remark 2 | Flip Chip Technology Overview and Early Beginnings -- Technology Trends of Flip Chip -- Bumping Technologies -- Flip-Chip Interconnections: Past, Present and Future -- Underfill -- Conductive Adhesives for Flip Chip Applications -- Enabling Substrate Technologies: Past, Present and Future -- IC-Package-System Integrated Design -- Thermal Management of Flip Chip Packages -- Thermo-Mechanical Reliability in Flip Chip Packages -- Interfacial Reactions and Electromigration in Flip-Chip Solder Joints. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also: Offers broad-ranging chapters with a focus on IC-package-system integration Provides viewpoints from leading industry executives and experts Details state-of-the-art achievements in process technologies and scientific research Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging. |
| 700 1# - AUTHOR 2 | |
| Author 2 | Tong, Ho-Ming. |
| 700 1# - AUTHOR 2 | |
| Author 2 | Lai, Yi-Shao. |
| 700 1# - AUTHOR 2 | |
| Author 2 | Wong, C.P. |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | http://dx.doi.org/10.1007/978-1-4419-5768-9 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | eBooks |
| 264 #1 - | |
| -- | Boston, MA : |
| -- | Springer US : |
| -- | Imprint: Springer, |
| -- | 2013. |
| 336 ## - | |
| -- | text |
| -- | txt |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | c |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | cr |
| -- | rdacarrier |
| 347 ## - | |
| -- | text file |
| -- | |
| -- | rda |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Engineering. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronics. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Microelectronics. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronic circuits. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Optical materials. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronic materials. |
| 650 14 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Engineering. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronics and Microelectronics, Instrumentation. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Circuits and Systems. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Optical and Electronic Materials. |
| 912 ## - | |
| -- | ZDB-2-ENG |
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