Advanced electronic packaging. (Record no. 59382)

000 -LEADER
fixed length control field 06652nam a2201501 i 4500
001 - CONTROL NUMBER
control field 5263046
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20200421114112.0
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 100317t20152005nju o 000 0 eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
ISBN 9780470544082
-- electronic
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
-- paper
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
-- electronic
082 04 - CLASSIFICATION NUMBER
Call Number 621.381046
245 00 - TITLE STATEMENT
Title Advanced electronic packaging.
250 ## - EDITION STATEMENT
Edition statement 2nd ed. /
300 ## - PHYSICAL DESCRIPTION
Number of Pages 1 PDF (784 pages).
490 1# - SERIES STATEMENT
Series statement IEEE press series on microelectronic systems ;
500 ## - GENERAL NOTE
Remark 1 Previous ed.: New York: IEEE, 1999.
505 0# - FORMATTED CONTENTS NOTE
Remark 2 List of Contributors. List of Acronyms. Preface. Introduction and Overview of Microelectronics Packaging (W. Brown). Microelectronics Packaging Materials and Applications (W. Brown). Electrical Design Considerations (S. Ang). Modeling and Simulation (L. Schaper). Thermal Design and Management of Electronics (R. Couvillion). Mechanical Design Considerations (W. Schmidt). Packaging Trade-Offs and Decisions (L. Schaper). Computer-Aided Engineering and Design (D. Andrews, et al.). Processing Technologies in Microelectronic Packaging (H. Naseem). Materials and Processing Considerations (S. Ang & W. Brown). Reliability Considerations (R. Ulrich). Testing and Qualification (S. Kolluru & D. Berleant). Mainframe Packaging: The Thermal Conduction Module (TCM) (T. Lenihan). An Industry Perspective on MCM-D (J. Demmin). Automotive Multichip Modules (R. Johnson & J. Evans). Analyticaln Techniques for Materials Characterization (S. Nasrazadani, et al.). Cost Considerations (E. Malstrom). Advances Topics and Future Trends in MCM Technology (J. Brewer, et al.). Index. About the Editor.
520 ## - SUMMARY, ETC.
Summary, etc Packaging is rapidly becoming an area of microeclectronics technology which can limit the operating speed on an integrated circuit. To address this concern, much research and development attention now focuses on packaging in an effort to prevent it from impeding the speed of electronic systems. With Advanced Electronic Packaging, readers can learn about the full range of packaging concepts, from the introductory to the advanced level, and gain a deeper understanding of this rapidly growing area of microelectronics. As an excellent desk reference for practicing engineers or as an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the fabrication, testing, reliability, and packaging of integrated circuits, specifically, multichip modules (MCM). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design tradeoffs. Also addressed are the critical role of economics and future trends in electronic packaging. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
700 1# - AUTHOR 2
Author 2 Brown, William D.,
700 1# - AUTHOR 2
Author 2 Ulrich, Richard K.
856 42 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5263046
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type eBooks
264 #1 -
-- Hoboken, New Jersey :
-- Wiley,
-- 2005.
264 #2 -
-- [Piscataqay, New Jersey] :
-- IEEE Xplore,
-- 2009.
336 ## -
-- text
-- rdacontent
337 ## -
-- electronic
-- isbdmedia
338 ## -
-- online resource
-- rdacarrier
588 ## -
-- Description based on PDF viewed 12/21/2015.
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Microelectronic packaging.
695 ## -
-- Adhesives
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-- Assembly
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-- Automotive engineering
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-- Biographies
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-- Ceramics
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-- Clocks
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-- Complexity theory
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-- Computer aided engineering
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-- Computers
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-- Conductivity
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-- Conductors
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-- Cooling
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-- Costing
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-- Delay
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-- Design automation
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-- Dielectric materials
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-- Dielectrics
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-- Electromagnetic interference
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-- Electronic components
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-- Electronics packaging
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-- Engines
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-- Fabrication
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-- Face
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-- Failure analysis
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-- Finite element methods
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-- Force
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-- Gold
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-- Hardware design languages
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-- Heat transfer
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-- Heating
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-- Indexes
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-- Inductance
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-- Industries
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-- Integrated circuit interconnections
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-- Integrated circuit modeling
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-- Integrated circuit technology
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-- Integrated circuits
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-- Lattices
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-- Leg
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-- Logic gates
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-- Maintenance engineering
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-- Manufacturing
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-- Marketing and sales
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-- Materials
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-- Mechanical power transmission
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-- Metals
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-- Microassembly
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-- Microelectronics
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-- Multichip modules
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-- Noise
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-- Packaging
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-- Performance evaluation
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-- Pins
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-- Plastics
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-- Polyimides
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-- Powders
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-- Power distribution
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-- Production
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-- Reliability
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-- Resistance
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-- Scanning electron microscopy
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-- Scattering
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-- Shape
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-- Silicon
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-- Software
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-- Solid modeling
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-- Solids
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-- Strain
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-- Strain measurement
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-- Stress
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-- Substrates
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-- Surface topography
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-- Surface treatment
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-- Testing
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-- Thermal conductivity
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-- Thermal management of electronics
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-- Thermal stability
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-- Warranties
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-- Wire
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-- Wiring
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-- X-ray diffraction

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