3D IC and RF SiPs : (Record no. 68570)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 04273cam a22005658i 4500 |
| 001 - CONTROL NUMBER | |
| control field | on1019839869 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20220711203251.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 180108s2018 nju ob 001 0 eng |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9781119289678 |
| -- | (pdf) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 111928967X |
| -- | (pdf) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9781119289661 |
| -- | (epub) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 1119289661 |
| -- | (epub) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9781119289654 |
| -- | (electronic bk. : oBook) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 1119289653 |
| -- | (electronic bk. : oBook) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| -- | (cloth) |
| 029 1# - (OCLC) | |
| OCLC library identifier | GBVCP |
| System control number | 101926067X |
| 029 1# - (OCLC) | |
| OCLC library identifier | CHVBK |
| System control number | 516426885 |
| 029 1# - (OCLC) | |
| OCLC library identifier | CHNEW |
| System control number | 001003061 |
| 082 00 - CLASSIFICATION NUMBER | |
| Call Number | 621.39/5 |
| 100 1# - AUTHOR NAME | |
| Author | Hwang, Lih-Tyng, |
| 245 10 - TITLE STATEMENT | |
| Title | 3D IC and RF SiPs : |
| Sub Title | advanced stacking and planar solutions for 5G mobility / |
| 250 ## - EDITION STATEMENT | |
| Edition statement | 1st edition. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | 1 online resource |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Remark 2 | Front Matter -- MM and MTM for Mobility -- Interconnects -- State-of-the-Art IC Packages, Modules, and Substrates -- Passives Technology -- Electrical Design for 5G Hardware-Digital Focus -- Electrical Design for 5G Hardware-RF Focus -- Product, Process Development, and Control -- Product Life and Reliability Assessment -- Hardware Solutions for 5G Mobility -- Appendices. A. Failure Mechanisms and Failure Analysis -- B. ANOVA -- C. Gauge R&R and DOE -- D. Statistics Tables -- Index |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility Lih-Tyng Hwang, National Sun Yat-Sen University, Taiwan, Jason Tzyy-Sheng Horng, National Sun Yat-Sen University, Taiwan A concise summary of the state of the art, this book is an interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments. Readers are introduced to the markets, technology drivers, integrated circuits, packaging and substrate trends that go hand-in-hand with the development of 3D IC and RF SiP, as well as related digital and RF designs, and product life and reliability assessments. Smart phone tear-down is used to illustrate the key components for mobility (4G and future 5G), such as AP/mobile memory and RFIC/RF FE. Other essential topics include packaging technology, high density logic design, RF system integration and future trends℗¿in MTM technology. . Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility. Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft¿́¿s Excel and Minitab. Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail. Provides chapter-wise review questions and powerpoint slides as teaching tools 3D IC and RF SiPs offers graduate students and researchers an essential guide to advanced stacking and planar solutions for 5G mobility. It can also be used as a reference text for engineers and advanced students of semiconductors, communications hardware, and IC packaging technologies. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| General subdivision | Technological innovations. |
| 650 #7 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| General subdivision | Technological innovations. |
| 700 1# - AUTHOR 2 | |
| Author 2 | Horng, Tzyy-sheng Jason, |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | https://doi.org/10.1002/9781119289654 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | eBooks |
| 264 #1 - | |
| -- | Hoboken, NJ : |
| -- | John Wiley & Sons, |
| -- | 2018. |
| 336 ## - | |
| -- | text |
| -- | txt |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | c |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | cr |
| -- | rdacarrier |
| 588 0# - | |
| -- | Print version record and CIP data provided by publisher; resource not viewed. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Mobile communication systems |
| 650 #7 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Mobile communication systems |
| -- | (OCoLC)fst01024219 |
| 994 ## - | |
| -- | 92 |
| -- | DG1 |
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