Lead-free soldering process development and reliability / (Record no. 69292)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 03560cam a2200577 i 4500 |
| 001 - CONTROL NUMBER | |
| control field | on1150801725 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20220711203607.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 200131t20202020njua ob 001 0 eng |
| 019 ## - | |
| -- | 1162342677 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9781119482093 |
| -- | electronic book |
| -- | oBook |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 1119482097 |
| -- | electronic book |
| -- | oBook |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 1119482046 |
| -- | adobe electronic book |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9781119482048 |
| -- | (electronic bk.) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| -- | electronic publication |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| -- | electronic publication |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| -- | hardcover |
| 029 1# - (OCLC) | |
| OCLC library identifier | AU@ |
| System control number | 000067018513 |
| 082 00 - CLASSIFICATION NUMBER | |
| Call Number | 621.381/046 |
| 245 00 - TITLE STATEMENT | |
| Title | Lead-free soldering process development and reliability / |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | 1 online resource (xxii, 481 pages) : |
| 490 1# - SERIES STATEMENT | |
| Series statement | Wiley series in quality & reliability engineering |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | "This book discusses ongoing issues in electronics manufacturing production. Each topic is discussed by those who have conducted work in the field and can provide insight into what are the most important areas to consider. The book gives updates in areas for which research is ongoing, and addresses new topics which are relevant to lead-free soldering. Among the key topics the book highlights are emerging environmental legislation, developments in process engineering, alloys, PCB surface finishes, PCB laminates, reliability assessments and standards. A practicing engineer will find the book of use as it goes into these and other topics in sufficient detail to make it informative and a good practical guide to address issues of concern in these areas. Investigates high temperature, low temperature, and high reliability lead-free alloys. Describes the effects of intermetallic compound on reliability. Explains updates in lead-free rework technology including hand soldering, BGA rework, and PTH rework. Provides a guideline to going lead-free to industries that are complying with new environmental regulations, such as defense, aerospace, medical, and automotive industries"-- |
| 590 ## - LOCAL NOTE (RLIN) | |
| Local note | John Wiley and Sons |
| 700 1# - AUTHOR 2 | |
| Author 2 | Bath, Jasbir, |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | https://doi.org/10.1002/9781119482093 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | eBooks |
| 264 #1 - | |
| -- | Hoboken, NJ, USA : |
| -- | John Wiley & Sons, Inc., |
| -- | 2020. |
| 264 #4 - | |
| -- | ©2020 |
| 336 ## - | |
| -- | text |
| -- | txt |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | n |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | nc |
| -- | rdacarrier |
| 520 ## - SUMMARY, ETC. | |
| -- | Provided by publisher. |
| 588 ## - | |
| -- | Description based on online resource; title from digital title page (viewed on August 04, 2020). |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronic packaging. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Solder and soldering. |
| 650 #7 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronic packaging. |
| -- | (OCoLC)fst00907414 |
| 650 #7 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Solder and soldering. |
| -- | (OCoLC)fst01125221 |
| 994 ## - | |
| -- | 92 |
| -- | DG1 |
No items available.