Electronic packaging science and technology / (Record no. 69708)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 02971cam a22005538i 4500 |
| 001 - CONTROL NUMBER | |
| control field | on1268544247 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20220711203734.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 210916s2022 nju ob 001 0 eng |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9781119418344 |
| -- | (electronic bk. : oBook) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 1119418348 |
| -- | (electronic bk. : oBook) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9781119418337 |
| -- | (epub) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 111941833X |
| -- | (epub) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9781119418320 |
| -- | (adobe pdf) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 1119418321 |
| -- | (adobe pdf) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| -- | (cloth) |
| 029 1# - (OCLC) | |
| OCLC library identifier | AU@ |
| System control number | 000069923991 |
| 082 00 - CLASSIFICATION NUMBER | |
| Call Number | 621.381/046 |
| 100 1# - AUTHOR NAME | |
| Author | Tu, K. N. |
| 245 10 - TITLE STATEMENT | |
| Title | Electronic packaging science and technology / |
| 250 ## - EDITION STATEMENT | |
| Edition statement | 1st edition. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | 1 online resource |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | "This book focuses on modern technology and how electronic packaging plays a major role in moving technology forward. With the enhancement of mobile technology and its challenges, the need for packing technology solutions is evident. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology"-- |
| 700 1# - AUTHOR 2 | |
| Author 2 | Chen, Chih, |
| 700 1# - AUTHOR 2 | |
| Author 2 | Chen, Hung-Ming, |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | https://doi.org/10.1002/9781119418344 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | eBooks |
| 264 #1 - | |
| -- | Hoboken, NJ : |
| -- | Wiley, |
| -- | 2022. |
| 336 ## - | |
| -- | text |
| -- | txt |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | c |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | cr |
| -- | rdacarrier |
| 520 ## - SUMMARY, ETC. | |
| -- | Provided by publisher. |
| 588 ## - | |
| -- | Description based on print version record and CIP data provided by publisher; resource not viewed. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronic packaging. |
| 994 ## - | |
| -- | 92 |
| -- | DG1 |
No items available.