Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : (Record no. 69731)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 03102cam a2200517Ii 4500 |
| 001 - CONTROL NUMBER | |
| control field | on1288211078 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20220711203738.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 211211s2021 nju o 000 0 eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9781119793847 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 111979384X |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9781119793892 |
| -- | (electronic bk.) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 1119793890 |
| -- | (electronic bk.) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9781119793908 |
| -- | (electronic bk.) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 1119793904 |
| -- | (electronic bk.) |
| 029 1# - (OCLC) | |
| OCLC library identifier | AU@ |
| System control number | 000070396088 |
| 037 ## - | |
| -- | 9648539 |
| -- | IEEE |
| 082 04 - CLASSIFICATION NUMBER | |
| Call Number | 621.381/046 |
| 245 00 - TITLE STATEMENT | |
| Title | Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : |
| Sub Title | high performance compute and system-in-package / |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | 1 online resource (323 pages). |
| 490 1# - SERIES STATEMENT | |
| Series statement | IEEE Press series |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package , a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research. |
| 700 1# - AUTHOR 2 | |
| Author 2 | Keser, Beth, |
| 700 1# - AUTHOR 2 | |
| Author 2 | Kröhnert, Steffen, |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | https://doi.org/10.1002/9781119793908 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | eBooks |
| 264 #1 - | |
| -- | Newark : |
| -- | John Wiley & Sons, Incorporated, |
| -- | 2021. |
| 336 ## - | |
| -- | text |
| -- | txt |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | c |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | cr |
| -- | rdacarrier |
| 588 ## - | |
| -- | Description based upon print version of record. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Microelectronic packaging. |
| 650 #7 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Microelectronic packaging. |
| -- | (OCoLC)fst01019751 |
| 994 ## - | |
| -- | 92 |
| -- | DG1 |
No items available.