Antenna-in-package technology and applications / (Record no. 74641)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 03405nam a2200589 i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 9063370 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20220712210026.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 200429s2020 nju ob 001 eng d |
| 019 ## - | |
| -- | 1143846527 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 1119556651 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9781119556640 |
| -- | adobe pdf |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| -- | ePub |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 1119556643 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| -- | cloth |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| -- | electronic bk. |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| -- | electronic bk. |
| 082 00 - CLASSIFICATION NUMBER | |
| Call Number | 621.382/4 |
| 245 00 - TITLE STATEMENT | |
| Title | Antenna-in-package technology and applications / |
| 250 ## - EDITION STATEMENT | |
| Edition statement | First edition. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | 1 PDF. |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Remark 2 | Antennas for AiP technology / Yueping Zhang -- Package technologies / Dr Ning Ye -- Electrical, mechanical, and thermal co-design / Xiaoxiong Gu and Pritish R Parida. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | "This book starts with some historical notes about how AiP technology has evolved as we know it today. Then, the authors consider antennas and packages, thermal analysis and design, and measurement setups and methods for AiP technology. The authors show that the choice of antennas is usually given to those popular antennas that can be easily designed for the applications; the choice of packages is a trade-off among constraints such as electrical performance, thermo-mechanical reliability, compactness, manufacturability and cost; the choice of interconnects is governed by JEDEC for automatic assembly. Next, the book describes respectively low-temperature co-fired ceramic (LTCC), high-density interconnects (HDI), fan-out wafer level packaging (FOWLP) based AiP, and 3D-printing-based AiP. After that, the authors discuss in details the surface laminar circuit (SLC) based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Finally, the book touches on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications"-- |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| Subject | Microstrip antennas. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| Subject | Microelectronic packaging. |
| 700 1# - AUTHOR 2 | |
| Author 2 | Liu, Duixian, |
| 700 1# - AUTHOR 2 | |
| Author 2 | Zhang, Yueping, |
| 856 42 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | https://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=9063370 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | eBooks |
| 264 #1 - | |
| -- | Hoboken, New Jersey : |
| -- | Wiley-IEEE Press, |
| -- | [2020] |
| 264 #2 - | |
| -- | [Piscataqay, New Jersey] : |
| -- | IEEE Xplore, |
| -- | [2020] |
| 336 ## - | |
| -- | text |
| -- | rdacontent |
| 337 ## - | |
| -- | electronic |
| -- | isbdmedia |
| 338 ## - | |
| -- | online resource |
| -- | rdacarrier |
| 520 ## - SUMMARY, ETC. | |
| -- | Provided by publisher. |
No items available.