Advanced Thermal Stress Analysis of Smart Materials and Structures (Record no. 75826)

000 -LEADER
fixed length control field 04107nam a22005655i 4500
001 - CONTROL NUMBER
control field 978-3-030-25201-4
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20220801214001.0
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 190903s2020 sz | s |||| 0|eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
ISBN 9783030252014
-- 978-3-030-25201-4
082 04 - CLASSIFICATION NUMBER
Call Number 620.105
100 1# - AUTHOR NAME
Author Chen, Zengtao.
245 10 - TITLE STATEMENT
Title Advanced Thermal Stress Analysis of Smart Materials and Structures
250 ## - EDITION STATEMENT
Edition statement 1st ed. 2020.
300 ## - PHYSICAL DESCRIPTION
Number of Pages X, 304 p. 104 illus., 44 illus. in color.
490 1# - SERIES STATEMENT
Series statement Structural Integrity,
505 0# - FORMATTED CONTENTS NOTE
Remark 2 Heat conduction and moisture diffusion theories -- Basic Problems of Non-Fourier Heat Conduction -- Multiphysics of smart materials and structures -- Coupled thermal stresses in advanced and smart materials -- Thermal Fracture of Advanced Materials based on Fourier Heat Conduction -- Advanced thermal fracture analysis based on non-Fourier heat conduction models -- Future Perspectives.
520 ## - SUMMARY, ETC.
Summary, etc This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures. The book contains six chapters and starts with a brief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introduced through reviewing the methods for solving non-Fourier heat conduction theories and by presenting transient heat transport in representative homogeneous and advanced heterogeneous materials. The book provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry. A series of uncoupled thermal stress analyses on one-dimensional structures are also included. The volume ends with coupled thermal stress analyses of one-dimensional homogenous and heterogeneous smart piezoelectric structures considering different coupled thermopiezoelectric theories. Last but not least, fracture behavior of smart structures under thermal disturbance is investigated and the authors propose directions for future research on the topic of multiphysical analysis of smart materials. .
700 1# - AUTHOR 2
Author 2 Akbarzadeh, Abdolhamid.
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier https://doi.org/10.1007/978-3-030-25201-4
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type eBooks
264 #1 -
-- Cham :
-- Springer International Publishing :
-- Imprint: Springer,
-- 2020.
336 ## -
-- text
-- txt
-- rdacontent
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-- computer
-- c
-- rdamedia
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-- online resource
-- cr
-- rdacarrier
347 ## -
-- text file
-- PDF
-- rda
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Mechanics, Applied.
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Solids.
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Materials—Analysis.
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Mathematical models.
650 14 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Solid Mechanics.
650 24 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Characterization and Analytical Technique.
650 24 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Mathematical Modeling and Industrial Mathematics.
830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE
-- 2522-5618 ;
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-- ZDB-2-ENG
912 ## -
-- ZDB-2-SXE

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