3D Microelectronic Packaging (Record no. 77670)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 04484nam a22006135i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 978-981-15-7090-2 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20220801215614.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 201123s2021 si | s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9789811570902 |
| -- | 978-981-15-7090-2 |
| 082 04 - CLASSIFICATION NUMBER | |
| Call Number | 621.3815 |
| 245 10 - TITLE STATEMENT | |
| Title | 3D Microelectronic Packaging |
| Sub Title | From Architectures to Applications / |
| 250 ## - EDITION STATEMENT | |
| Edition statement | 2nd ed. 2021. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | XVII, 622 p. 299 illus., 205 illus. in color. |
| 490 1# - SERIES STATEMENT | |
| Series statement | Springer Series in Advanced Microelectronics, |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Remark 2 | 1. Introduction to 3D microelectronic packaging -- 2. 3D packaging architecture and assembly process design -- 3. Fundamentals of TSV processing and reliability -- 4. Mechanical properties of TSV -- 5. Atomistic View of TSV Protrusion/Intrusion -- 6. Fundamentals and failures in Die preparation for 3D packaging -- 7. Direct Cu to Cu bonding and other alternative interconnects in 3D packaging -- 8. Emerging hybrid bonding techniques for 3D packaging -- 9. Fundamental of Thermal Compressive Bonding process, advanced epoxy, and flux materials in 3D packaging -- 10. Fundamentals of solder alloys in 3D packaging -- 11. Fundamentals of electro migration in interconnects of 3D packages -- 12. Fundamentals of heat dissipation in 3D packaging -- 13. Fundamentals of advanced materials and process in substrate technology -- 14. New substrate technologies for 3D packaging. -15. Thermal mechanical and moisture modeling in 3D packaging -- 16. Stress and Strain measurements in 3D packaging -- 17.Processing and Reliability of Solder Interconnections in Stacked Packaging -- 18. Interconnect Quality and Reliability of 3D Packaging -- 19. Fundamentals of automotive reliability of 3D packages -- 20. Fault isolation and failure analysis of 3D packaging. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development. . |
| 700 1# - AUTHOR 2 | |
| Author 2 | Li, Yan. |
| 700 1# - AUTHOR 2 | |
| Author 2 | Goyal, Deepak. |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | https://doi.org/10.1007/978-981-15-7090-2 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | eBooks |
| 264 #1 - | |
| -- | Singapore : |
| -- | Springer Nature Singapore : |
| -- | Imprint: Springer, |
| -- | 2021. |
| 336 ## - | |
| -- | text |
| -- | txt |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | c |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | cr |
| -- | rdacarrier |
| 347 ## - | |
| -- | text file |
| -- | |
| -- | rda |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronic circuits. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronics. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Optical materials. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Microtechnology. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Microelectromechanical systems. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Metals. |
| 650 14 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronic Circuits and Systems. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronics and Microelectronics, Instrumentation. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Optical Materials. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Microsystems and MEMS. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Metals and Alloys. |
| 830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE | |
| -- | 2197-6643 ; |
| 912 ## - | |
| -- | ZDB-2-ENG |
| 912 ## - | |
| -- | ZDB-2-SXE |
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