Semiconductor Advanced Packaging (Record no. 78519)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 02991nam a22005295i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 978-981-16-1376-0 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20220801220407.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 210517s2021 si | s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9789811613760 |
| -- | 978-981-16-1376-0 |
| 082 04 - CLASSIFICATION NUMBER | |
| Call Number | 621.381 |
| 100 1# - AUTHOR NAME | |
| Author | Lau, John H. |
| 245 10 - TITLE STATEMENT | |
| Title | Semiconductor Advanced Packaging |
| 250 ## - EDITION STATEMENT | |
| Edition statement | 1st ed. 2021. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | XXII, 498 p. 557 illus., 530 illus. in color. |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Remark 2 | Recent Advance on Semiconductor Packaging -- System-in-Package -- Fan-In Wafer/Panel-Level Chip-Scale Packages -- Fan-Out Wafer/Panel-Level Packaging -- 2D, 2.1D, and 2.3D IC Integration -- 2.5D IC Integration -- 3D IC Integration -- Hybrid Bonding -- Chiplets Packaging -- Dielectric Materials -- Trends and Roadmap for Advanced Semiconductor Packaging. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc. |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | https://doi.org/10.1007/978-981-16-1376-0 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | eBooks |
| 264 #1 - | |
| -- | Singapore : |
| -- | Springer Nature Singapore : |
| -- | Imprint: Springer, |
| -- | 2021. |
| 336 ## - | |
| -- | text |
| -- | txt |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | c |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | cr |
| -- | rdacarrier |
| 347 ## - | |
| -- | text file |
| -- | |
| -- | rda |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronics. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Semiconductors. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Industrial engineering. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Production engineering. |
| 650 14 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronics and Microelectronics, Instrumentation. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Semiconductors. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Industrial and Production Engineering. |
| 912 ## - | |
| -- | ZDB-2-ENG |
| 912 ## - | |
| -- | ZDB-2-SXE |
No items available.