Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering (Record no. 78706)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 03959nam a22006255i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 978-3-319-77872-3 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20220801220554.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 180427s2018 sz | s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9783319778723 |
| -- | 978-3-319-77872-3 |
| 082 04 - CLASSIFICATION NUMBER | |
| Call Number | 670 |
| 100 1# - AUTHOR NAME | |
| Author | Seok, Seonho. |
| 245 10 - TITLE STATEMENT | |
| Title | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering |
| Sub Title | Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method / |
| 250 ## - EDITION STATEMENT | |
| Edition statement | 1st ed. 2018. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | VIII, 115 p. 106 illus. |
| 490 1# - SERIES STATEMENT | |
| Series statement | Springer Series in Advanced Manufacturing, |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Remark 2 | Overview of MEMS packaging technologies -- Adhesion control techniques for debonding -- FEM modeling of debonding -- Polymer cap transfer packaging technologies -- Thin film cap transfer packaging technology -- Other related manufacturing technologies. . |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load–displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology. |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | https://doi.org/10.1007/978-3-319-77872-3 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | eBooks |
| 264 #1 - | |
| -- | Cham : |
| -- | Springer International Publishing : |
| -- | Imprint: Springer, |
| -- | 2018. |
| 336 ## - | |
| -- | text |
| -- | txt |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | c |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | cr |
| -- | rdacarrier |
| 347 ## - | |
| -- | text file |
| -- | |
| -- | rda |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Manufactures. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Nanotechnology. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Microtechnology. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Microelectromechanical systems. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Materials—Analysis. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Coatings. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Tribology. |
| 650 14 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Machines, Tools, Processes. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Nanotechnology. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Microsystems and MEMS. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Characterization and Analytical Technique. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Coatings. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Tribology. |
| 830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE | |
| -- | 2196-1735 |
| 912 ## - | |
| -- | ZDB-2-ENG |
| 912 ## - | |
| -- | ZDB-2-SXE |
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