More-than-Moore 2.5D and 3D SiP Integration (Record no. 79219)

000 -LEADER
fixed length control field 02764nam a22005055i 4500
001 - CONTROL NUMBER
control field 978-3-319-52548-8
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20220801221031.0
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 170208s2017 sz | s |||| 0|eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
ISBN 9783319525488
-- 978-3-319-52548-8
082 04 - CLASSIFICATION NUMBER
Call Number 621.3815
100 1# - AUTHOR NAME
Author Radojcic, Riko.
245 10 - TITLE STATEMENT
Title More-than-Moore 2.5D and 3D SiP Integration
250 ## - EDITION STATEMENT
Edition statement 1st ed. 2017.
300 ## - PHYSICAL DESCRIPTION
Number of Pages XV, 182 p. 68 illus., 66 illus. in color.
505 0# - FORMATTED CONTENTS NOTE
Remark 2 Introduction -- More-than-Moore Technology Opportunities: 2.5D SiP -- More-than-Moore Technology Opportunities: 3D SiP -- More-than-Moore Design Eco-System -- More-than-Moore Adoption Landscape.
520 ## - SUMMARY, ETC.
Summary, etc This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product. .
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier https://doi.org/10.1007/978-3-319-52548-8
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type eBooks
264 #1 -
-- Cham :
-- Springer International Publishing :
-- Imprint: Springer,
-- 2017.
336 ## -
-- text
-- txt
-- rdacontent
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-- computer
-- c
-- rdamedia
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-- online resource
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-- rdacarrier
347 ## -
-- text file
-- PDF
-- rda
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Electronic circuits.
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Microprocessors.
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Computer architecture.
650 14 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Electronic Circuits and Systems.
650 24 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Processor Architectures.
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-- ZDB-2-ENG
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-- ZDB-2-SXE

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