Carbon Nanotubes for Interconnects (Record no. 79960)

000 -LEADER
fixed length control field 03960nam a22005295i 4500
001 - CONTROL NUMBER
control field 978-3-319-29746-0
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20220801221715.0
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 160709s2017 sz | s |||| 0|eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
ISBN 9783319297460
-- 978-3-319-29746-0
082 04 - CLASSIFICATION NUMBER
Call Number 621.3815
245 10 - TITLE STATEMENT
Title Carbon Nanotubes for Interconnects
Sub Title Process, Design and Applications /
250 ## - EDITION STATEMENT
Edition statement 1st ed. 2017.
300 ## - PHYSICAL DESCRIPTION
Number of Pages XII, 333 p. 167 illus., 133 illus. in color.
505 0# - FORMATTED CONTENTS NOTE
Remark 2 Interconnect challenges for 2D and 3D Integration -- Overview of Carbon Nanotube Physical Properties -- Overview of Carbon Nanotube Processing Methods -- Electrical Conductivity of Carbon Nanotubes – Modeling and Characterization -- Computational Studies of Thermal Transport Properties of Carbon Nanotube Material -- Overview of Carbon Nanotubes for Horizontal On-Chip Interconnects -- Carbon Nanotubes as Vertical Interconnects for 3D ICs -- Carbon Nanotubes as Micro-Bumps for 3D Integration -- Electrothermal Modeling of Carbon Nanotubes TSVs -- Exploring Carbon Nanotubes for 3D Power Delivery Networks -- Carbon Nanotubes for Monolithic 3D ICs.
520 ## - SUMMARY, ETC.
Summary, etc This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. Provides a single-source reference on carbon nanotubes for interconnect applications; Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects; Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects.
700 1# - AUTHOR 2
Author 2 Todri-Sanial, Aida.
700 1# - AUTHOR 2
Author 2 Dijon, Jean.
700 1# - AUTHOR 2
Author 2 Maffucci, Antonio.
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier https://doi.org/10.1007/978-3-319-29746-0
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type eBooks
264 #1 -
-- Cham :
-- Springer International Publishing :
-- Imprint: Springer,
-- 2017.
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-- txt
-- rdacontent
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-- computer
-- c
-- rdamedia
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-- online resource
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-- rdacarrier
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-- text file
-- PDF
-- rda
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Electronic circuits.
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Microprocessors.
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Computer architecture.
650 14 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Electronic Circuits and Systems.
650 24 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Processor Architectures.
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-- ZDB-2-ENG
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-- ZDB-2-SXE

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