Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect (Record no. 80915)
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000 -LEADER | |
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fixed length control field | 02865nam a22005775i 4500 |
001 - CONTROL NUMBER | |
control field | 978-981-10-6165-3 |
005 - DATE AND TIME OF LATEST TRANSACTION | |
control field | 20220801222552.0 |
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
fixed length control field | 170908s2018 si | s |||| 0|eng d |
020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
ISBN | 9789811061653 |
-- | 978-981-10-6165-3 |
082 04 - CLASSIFICATION NUMBER | |
Call Number | 670 |
100 1# - AUTHOR NAME | |
Author | Cheng, Jie. |
245 10 - TITLE STATEMENT | |
Title | Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect |
250 ## - EDITION STATEMENT | |
Edition statement | 1st ed. 2018. |
300 ## - PHYSICAL DESCRIPTION | |
Number of Pages | XVIII, 137 p. 103 illus. |
490 1# - SERIES STATEMENT | |
Series statement | Springer Theses, Recognizing Outstanding Ph.D. Research, |
520 ## - SUMMARY, ETC. | |
Summary, etc | This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research. |
856 40 - ELECTRONIC LOCATION AND ACCESS | |
Uniform Resource Identifier | https://doi.org/10.1007/978-981-10-6165-3 |
942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
Koha item type | eBooks |
264 #1 - | |
-- | Singapore : |
-- | Springer Nature Singapore : |
-- | Imprint: Springer, |
-- | 2018. |
336 ## - | |
-- | text |
-- | txt |
-- | rdacontent |
337 ## - | |
-- | computer |
-- | c |
-- | rdamedia |
338 ## - | |
-- | online resource |
-- | cr |
-- | rdacarrier |
347 ## - | |
-- | text file |
-- | |
-- | rda |
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
-- | Manufactures. |
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
-- | Coatings. |
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
-- | Tribology. |
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
-- | Corrosion and anti-corrosives. |
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
-- | Electronics. |
650 14 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
-- | Machines, Tools, Processes. |
650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
-- | Coatings. |
650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
-- | Tribology. |
650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
-- | Corrosion. |
650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
-- | Electronics and Microelectronics, Instrumentation. |
830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE | |
-- | 2190-5061 |
912 ## - | |
-- | ZDB-2-ENG |
912 ## - | |
-- | ZDB-2-SXE |
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