Crosstalk in Modern On-Chip Interconnects (Record no. 81066)

000 -LEADER
fixed length control field 03746nam a22005655i 4500
001 - CONTROL NUMBER
control field 978-981-10-0800-9
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20220801222714.0
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 160406s2016 si | s |||| 0|eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
ISBN 9789811008009
-- 978-981-10-0800-9
082 04 - CLASSIFICATION NUMBER
Call Number 621.381
100 1# - AUTHOR NAME
Author Kaushik, B.K.
245 10 - TITLE STATEMENT
Title Crosstalk in Modern On-Chip Interconnects
Sub Title A FDTD Approach /
250 ## - EDITION STATEMENT
Edition statement 1st ed. 2016.
300 ## - PHYSICAL DESCRIPTION
Number of Pages XV, 116 p. 71 illus.
490 1# - SERIES STATEMENT
Series statement SpringerBriefs in Applied Sciences and Technology,
505 0# - FORMATTED CONTENTS NOTE
Remark 2 Introduction to On-chip Interconnects and Modeling -- Interconnect Modeling, CNT and GNR Structure, Properties and Characteristics -- FDTD Model for Crosstalk Analysis of CMOS Gate-Driven Coupled Copper Interconnects -- FDTD Model for Crosstalk Analysis of Multiwall Carbon Nanotube (MWCNT) Interconnects -- Crosstalk Modeling with Width Dependent MFP in MLGNR Interconnects Using FDTD Technique -- An Efficient US-FDTD Model for Crosstalk Analysis of On-chip Interconnects.
520 ## - SUMMARY, ETC.
Summary, etc The book provides accurate FDTD models for on-chip interconnects, covering most recent advancements in materials and design. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for CNT and GNR based interconnects are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR-based interconnects are also discussed in the book. The proposed models are validated with the HSPICE simulations. The book introduces the current research scenario in the modeling of on-chip interconnects. It presents the structure, properties, and characteristics of graphene based on-chip interconnects and the FDTD modeling of Cu based on-chip interconnects. The model considers the non-linear effects of CMOS driver as well as the transmission line effects of interconnect line that includes coupling capacitance and mutual inductance effects. In a more realistic manner, the proposed model includes the effect of width-dependent MFP of the MLGNR while taking into account the edge roughness.
700 1# - AUTHOR 2
Author 2 Kumar, V. Ramesh.
700 1# - AUTHOR 2
Author 2 Patnaik, Amalendu.
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier https://doi.org/10.1007/978-981-10-0800-9
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type eBooks
264 #1 -
-- Singapore :
-- Springer Nature Singapore :
-- Imprint: Springer,
-- 2016.
336 ## -
-- text
-- txt
-- rdacontent
337 ## -
-- computer
-- c
-- rdamedia
338 ## -
-- online resource
-- cr
-- rdacarrier
347 ## -
-- text file
-- PDF
-- rda
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Microtechnology.
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Microelectromechanical systems.
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Electronics.
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Electronic circuits.
650 14 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Microsystems and MEMS.
650 24 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Electronics and Microelectronics, Instrumentation.
650 24 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Electronic Circuits and Systems.
830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE
-- 2191-5318
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-- ZDB-2-ENG
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-- ZDB-2-SXE

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