Optical Interconnects (Record no. 85866)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 03196nam a22004935i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 978-3-031-02553-2 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20240730164730.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 220601s2008 sz | s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9783031025532 |
| -- | 978-3-031-02553-2 |
| 082 04 - CLASSIFICATION NUMBER | |
| Call Number | 621.3 |
| 100 1# - AUTHOR NAME | |
| Author | Chen, Ray T. |
| 245 10 - TITLE STATEMENT | |
| Title | Optical Interconnects |
| 250 ## - EDITION STATEMENT | |
| Edition statement | 1st ed. 2008. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | XI, 91 p. |
| 490 1# - SERIES STATEMENT | |
| Series statement | Synthesis Lectures on Solid State Materials and Devices, |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Remark 2 | Introduction -- Thinned Vertical Cavity Surface Emitting Laser Fabrication -- VCSEL Characterization -- Thermal Management of Embedded VCSEL -- Optical Interconnection Layer -- System Integration -- Summary -- Effects of Thermal-Via Structures on Thin Film VCSELs for a Fully Embedded Board-Level Optical Interconnection System. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing. |
| 700 1# - AUTHOR 2 | |
| Author 2 | Choi, Chulchae. |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | https://doi.org/10.1007/978-3-031-02553-2 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | eBooks |
| 264 #1 - | |
| -- | Cham : |
| -- | Springer International Publishing : |
| -- | Imprint: Springer, |
| -- | 2008. |
| 336 ## - | |
| -- | text |
| -- | txt |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | c |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | cr |
| -- | rdacarrier |
| 347 ## - | |
| -- | text file |
| -- | |
| -- | rda |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electrical engineering. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Materials science. |
| 650 14 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electrical and Electronic Engineering. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Materials Science. |
| 830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE | |
| -- | 1932-1724 |
| 912 ## - | |
| -- | ZDB-2-SXSC |
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