Investigation of Casting-Die Wall Interfacial Heat Transfer During Solidification of AI-Cu-Si (LM 21) Alloy Plates
By: Chowdary,T.Bheemappa
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Material type: ![materialTypeLabel](/opac-tmpl/lib/famfamfam/BK.png)
Item type | Current location | Collection | Call number | Status | Date due | Barcode |
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CENTRAL LIBRARY | M.Tech Thesis | 378.242 C552I (Browse shelf) | Not for loan | TH063881 |
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