Advanced electronic packaging.
Contributor(s): Brown, William D
| Ulrich, Richard K. (Richard Kevin) | John Wiley & Sons [publisher.] | IEEE Xplore (Online service) [distributor.].
Material type: 
BookSeries: IEEE press series on microelectronic systems: 1Publisher: Hoboken, New Jersey : Wiley, 2005Distributor: [Piscataqay, New Jersey] : IEEE Xplore, 2009Edition: 2nd ed. / edited by William D. Brown, Richard K. Ulrich.Description: 1 PDF (784 pages).Content type: text Media type: electronic Carrier type: online resourceISBN: 9780470544082.Subject(s): Microelectronic packaging | Adhesives | Assembly | Automotive engineering | Biographies | Ceramics | Clocks | Complexity theory | Computer aided engineering | Computers | Conductivity | Conductors | Cooling | Costing | Delay | Design automation | Dielectric materials | Dielectrics | Electromagnetic interference | Electronic components | Electronics packaging | Engines | Fabrication | Face | Failure analysis | Finite element methods | Force | Gold | Hardware design languages | Heat transfer | Heating | Indexes | Inductance | Industries | Integrated circuit interconnections | Integrated circuit modeling | Integrated circuit technology | Integrated circuits | Lattices | Leg | Logic gates | Maintenance engineering | Manufacturing | Marketing and sales | Materials | Mechanical power transmission | Metals | Microassembly | Microelectronics | Multichip modules | Noise | Packaging | Performance evaluation | Pins | Plastics | Polyimides | Powders | Power distribution | Production | Reliability | Resistance | Scanning electron microscopy | Scattering | Shape | Silicon | Software | Solid modeling | Solids | Strain | Strain measurement | Stress | Substrates | Surface topography | Surface treatment | Testing | Thermal conductivity | Thermal management of electronics | Thermal stability | Warranties | Wire | Wiring | X-ray diffractionGenre/Form: Electronic books.Additional physical formats: Print version:: No titleDDC classification: 621.381046 Online resources: Abstract with links to resource Also available in print.Previous ed.: New York: IEEE, 1999.
List of Contributors. List of Acronyms. Preface. Introduction and Overview of Microelectronics Packaging (W. Brown). Microelectronics Packaging Materials and Applications (W. Brown). Electrical Design Considerations (S. Ang). Modeling and Simulation (L. Schaper). Thermal Design and Management of Electronics (R. Couvillion). Mechanical Design Considerations (W. Schmidt). Packaging Trade-Offs and Decisions (L. Schaper). Computer-Aided Engineering and Design (D. Andrews, et al.). Processing Technologies in Microelectronic Packaging (H. Naseem). Materials and Processing Considerations (S. Ang & W. Brown). Reliability Considerations (R. Ulrich). Testing and Qualification (S. Kolluru & D. Berleant). Mainframe Packaging: The Thermal Conduction Module (TCM) (T. Lenihan). An Industry Perspective on MCM-D (J. Demmin). Automotive Multichip Modules (R. Johnson & J. Evans). Analyticaln Techniques for Materials Characterization (S. Nasrazadani, et al.). Cost Considerations (E. Malstrom). Advances Topics and Future Trends in MCM Technology (J. Brewer, et al.). Index. About the Editor.
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Packaging is rapidly becoming an area of microeclectronics technology which can limit the operating speed on an integrated circuit. To address this concern, much research and development attention now focuses on packaging in an effort to prevent it from impeding the speed of electronic systems. With Advanced Electronic Packaging, readers can learn about the full range of packaging concepts, from the introductory to the advanced level, and gain a deeper understanding of this rapidly growing area of microelectronics. As an excellent desk reference for practicing engineers or as an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the fabrication, testing, reliability, and packaging of integrated circuits, specifically, multichip modules (MCM). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design tradeoffs. Also addressed are the critical role of economics and future trends in electronic packaging. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Also available in print.
Mode of access: World Wide Web
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