Accelerated stress testing handbook : guide for achieving quality products / edited by H. Anthony Chan, Paul J. Englert.
Contributor(s): Chan, H. Anthony | Englert, Paul J | John Wiley & Sons [publisher.] | IEEE Xplore (Online service) [distributor.].
Material type: BookPublisher: New York : IEEE Press, c2001Distributor: [Piscataqay, New Jersey] : IEEE Xplore, [2009]Description: 1 PDF (xxii, 372 pages) : illustrations.Content type: text Media type: electronic Carrier type: online resourceISBN: 9780470544051.Subject(s): Electronic apparatus and appliances -- Testing | Electronic apparatus and appliances -- Reliability | Environmental testing | Acceleration | Approximation methods | Assembly | Availability | Barium | Benchmark testing | Bibliographies | Biographies | Books | Business | Central Processing Unit | Companies | Computer aided software engineering | Computers | Containers | Cooling | Databases | Degradation | Economics | Electric shock | Electronics industry | Equations | Failure analysis | Fatigue | Fixtures | Guidelines | Indexes | Industries | Integrated circuit interconnections | Internet | Lead | Life estimation | Liquids | Load modeling | Manufacturing | Manufacturing processes | Materials | Mathematical model | Monitoring | Nitrogen | Optical fibers | Optimization | Pediatrics | Portfolios | Power supplies | Power system reliability | Principal component analysis | Probability distribution | Product development | Production | Production facilities | Prototypes | Qualifications | Random access memory | Reliability | Reliability engineering | Reliability theory | Resonant frequency | Robustness | Safety | Scanning electron microscopy | Schedules | Sections | Sensors | Software | Soldering | Springs | Stress | Stress measurement | Surface treatment | Temperature control | Temperature distribution | Temperature measurement | Temperature sensors | Terminology | Test equipment | Testing | Thermal analysis | Thermal loading | Thermal stresses | Throughput | Transient analysis | Vibration measurement | VibrationsGenre/Form: Electronic books.Additional physical formats: Print version:: No titleDDC classification: 620/.00452 | 658.5/7 Online resources: Abstract with links to resource Also available in print.Includes bibliographical references (p. 340-363) and index.
Foreword (F. Ianna). Preface. Acknowledgments. OVERVIEW. Introduction (H. Chan and P. Englert). Principles of Stress Testing (H. Chan and P. Englert). PROCESS AND GUIDELINES. Stress Testing Program: Generic Processes (H. Chan and P. Englert). Stress Testing Program Subprocesses (H. Chan and P. Englert). Guidelines for Design and Manufacturing Stress Testing (H. Chan and P. Englert). THEORY. Economic and Optimization (H. Chan and P. Englert). Reliability Growth (C. Seusy). Overview of the Failure Analysis Process for Electrical Components (G. Pfeiffer). EQUIPMENT AND TECHNIQUES. Accelerated Stress Testing Equipment and Techniques (C. Felkins). Vibration and Shock Inputs Identify Some Failure Modes (W. Tustin). Relative Effectiveness of Thermal Cycling Versus Burn-In (K. Lo and F. LoVasco). Accelerated Qualification of Electronic Assemblies Under Combined Temperature Cycling and Vibration Environments: Is Miner's Hypothesis Valid (K. Upadhyayula and A. Dasgupta)? Liquid Environmental Stress Testing (LEST) (P. Englert). Safety Qualification of Stress Testing (S. Rajaram). BEST PRACTICES CASE STUDIES IN COMPUTER, COMMUNICATIONS, AND OTHER INDUSTRIES. Production Ast with Computers Using the Taguchi Method (D. Pachuki). Design Ast with Vendor Electronics (C. Schinner). Design and Production Ast with Power Supplies (D. Dalland). Design and Production Ast with Computers (E. Kyser). Qualifications and Production Sampling Ast with Printed Circuit Boards (H. McLean). Manufacturing Ast with Telecommunication Products (T. Parker and G. Harrison). Production Ast with Computer Disks. Benchmarking (H. Malec). Glossary of Stress Testing Terminology. Bibliography. Index. Epilogue. About the Editors.
Restricted to subscribers or individual electronic text purchasers.
As we move closer to a genuinely global economy, the pressure to develop highly reliable products on ever-tighter schedules will increase. Part of a designer's "toolbox" for achieving product reliability in a compressed time frame should be a set of best practices for utilizing accelerated stress testing (AST). The Accelerated Stress Testing Handbook delineates a core set of AST practices as part of an overall methodology for enhancing hardware product reliability. The techniques presented will teach readers to identify design deficiencies and problems with component quality or manufacturing processes early in the product's life, and then to take corrective action as quickly as possible. A wide array of case studies gleaned from leading practitioners of AST supplement the theory and methodology, which will provide the reader with a more concrete idea of how AST truly enhances quality in a reduced time frame. Important topics covered include: . Theoretical basis for AST. General AST best practices. AST design and manufacturing processes. AST equipment and techniques. AST process safety qualification In this handbook, AST cases studies demonstrate thermal, vibration, electrical, and liquid stress application; failure mode analysis; and corrective action techniques. Individuals who would be interested in this book include: reliability engineers and researchers, mechanical and electrical engineers, those involved with all facets of electronics and telecommunications product design and manufacturing, and people responsible for implementing quality and process improvement programs.
Also available in print.
Mode of access: World Wide Web
Description based on PDF viewed 12/21/2015.
There are no comments for this item.