Central Library

Normal view MARC view ISBD view

Systems-Level Packaging for Millimeter-Wave Transceivers [electronic resource] / by Mladen Božanić, Saurabh Sinha.

By: Božanić, Mladen [author.].
Contributor(s): Sinha, Saurabh [author.] | SpringerLink (Online service).
Material type: materialTypeLabelBookSeries: Smart Sensors, Measurement and Instrumentation: 34Publisher: Cham : Springer International Publishing : Imprint: Springer, 2019Edition: 1st ed. 2019.Description: XV, 277 p. online resource.Content type: text Media type: computer Carrier type: online resourceISBN: 9783030146900.Subject(s): Wireless communication systems | Mobile communication systems | Engineering design | Cooperating objects (Computer systems) | Wireless and Mobile Communication | Engineering Design | Cyber-Physical SystemsAdditional physical formats: Printed edition:: No title; Printed edition:: No title; Printed edition:: No titleDDC classification: 621.384 Online resources: Click here to access online
Contents:
Introduction and Research Impact -- Millimeter-Wave Research Challenges.-Behavior of Active and Passive Devices at Millimeter-Wave Frequencies -- Integrated Substrates: Millimeter-Wave Transistor Technologies -- Discrete Substrates: Package Foundation -- Traditional Approach: System-on-Chip -- Multi-Chip Modules and Multi-Chip Packaging -- State-of-the-Art Approach: System-on-Package -- Evaluation of Research Questions, Remaining Research Gaps and Future Directions.
In: Springer Nature eBookSummary: This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.
    average rating: 0.0 (0 votes)
No physical items for this record

Introduction and Research Impact -- Millimeter-Wave Research Challenges.-Behavior of Active and Passive Devices at Millimeter-Wave Frequencies -- Integrated Substrates: Millimeter-Wave Transistor Technologies -- Discrete Substrates: Package Foundation -- Traditional Approach: System-on-Chip -- Multi-Chip Modules and Multi-Chip Packaging -- State-of-the-Art Approach: System-on-Package -- Evaluation of Research Questions, Remaining Research Gaps and Future Directions.

This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.

There are no comments for this item.

Log in to your account to post a comment.