Introduction -- Overall Picture of Product Development stages & where product engineers add value -- Get to know your products(s) intimately -- Put your reliability qualification plan & schedule together -- Put your characterization plans & schedule together -- Engineering Sample Phase -- Process Skew Lots (Assess Yield Variations, Yield pitfalls) -- Assess your products' Reliability using industry standard specifications -- Analysis of failures to root cause is the key to a robust product -- Get ready for Production Silicon -- Compliance to Industry & Customer Standards -- Ring out the kinks in your manufacturing flow early -- Enable your manufacturing sites -- Start looking at cost reduction & manufacturing simplification -- Finance - Budgeting for char., rel. qual, boards etc.

This book captures the author's 35+ years of learning & experience in the semiconductor chip industry to provide a proven roadmap for successful, new product introduction process, tailored specifically to the semiconductor industry. The content includes a simplified process flow, success metrics, execution guidelines, checklists & calculators. The presentation is based on a product engineering centric "NPI hub" and the author guides readers through the complete process of semiconductor new product introduction, ensuring a successful plan execution. Provides everything a semiconductor product engineer needs to know to introduce new products to the market most effectively in one book; Breaks down the process of new product introduction into different phases and what product engineers should be focusing their efforts on during each phase; Includes checklists & calculators that help readers to plan reliability qualification parameters & estimate qualitylevels for new products.