Esashi, Masayoshi,  1949- <br/><br/>
3D and circuit integration of MEMS 
Masayoshi Esashi. 
 - 1 online resource 
<br/><br/>Front Matter -- Overview / Masayoshi Esashi -- Bulk Micromachining / Xinxin Li, Heng Yang -- Enhanced Bulk Micromachining Based on MIS Process / Xinxin Li, Heng Yang -- Epitaxial Poly Si Surface Micromachining / Masayoshi Esashi -- Poly-SiGe Surface Micromachining / Carrie W Low, Sergio F Almeida, Emmanuel P Quvy, Roger T Howe -- Metal Surface Micromachining / Minoru Sasaki -- Heterogeneously Integrated Aluminum Nitride MEMS Resonators and Filters / Enes Calayir, Srinivas Merugu, Jaewung Lee, Navab Singh, Gianluca Piazza -- MEMS Using CMOS Wafer / Weileun Fang, Sheng-Shian Li, Yi Chiu, Ming-Huang Li -- Wafer Transfer / Masayoshi Esashi -- Piezoelectric MEMS / T Takeshi Kobayashi (AIST) -- Anodic Bonding / Masayoshi Esashi -- Direct Bonding / Hideki Takagi -- Metal Bonding / Joerg Froemel -- Reactive Bonding / Klaus Vogel, Silvia Braun, Christian Hofmann, Mathias Weiser, Maik Wiemer, Thomas Otto, Harald Kuhn -- Polymer Bonding / Xiaojing Wang, Frank Niklaus -- Soldering by Local Heating / Yu-Ting Cheng, Liwei Lin -- Packaging, Sealing, and Interconnection / Masayoshi Esashi -- Vacuum Packaging / Masayoshi Esashi -- Buried Channels in Monolithic Si / Kazusuke Maenaka -- Through-substrate Vias / Zhyao Wang -- Index 
<br/><br/><label>ISBN: </label>9783527823239 3527823239 9783527823253 3527823255 9783527823246 3527823247 
<br/><br/><label>Standard No.: </label>10.1002/9783527823239  doi 
<br/><br/><label>Source: </label>9783527823246  Wiley 
<br/><br/><label>Nat. Bib. No.: </label>GBC0J9522  bnb 
<br/><br/><label>Nat. Bib. Agency Control No.: </label>020043536  Uk 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectromechanical systems.<br/>Silicon-on-insulator technology.<br/>Integrated circuits.<br/>Metal oxide semiconductors, Complementary.<br/>Integrated circuits.<br/>Metal oxide semiconductors, Complementary.<br/>Microelectromechanical systems.<br/>Silicon-on-insulator technology.
<br/><br/><label>Index Terms--Genre/Form: </label><br/>Electronic books.
<br/><br/><label>LC Class. No.: </label>TK7875 
<br/><br/><label>Dewey Class. No.: </label>621.38152