Tu, K. N.  1937- <br/><br/>
Electronic packaging science and technology / 
King-Ning Tu, University of California, Los Angeles, United States of America; Chih Chen, National Chiao Tung University, Hsinchu, Taiwain; Hung-Ming Chen, National Chiao Tung University, Hsinchu, Taiwain. 
 - 1st edition. 
 - 1 online resource 
<br/><br/>Includes bibliographical references and index. 
<br/><br/> "This book focuses on modern technology and how electronic packaging plays a major role in moving technology forward. With the enhancement of mobile technology and its challenges, the need for packing technology solutions is evident. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology"-- 
<br/><br/><label>ISBN: </label>9781119418344 1119418348 9781119418337 111941833X 9781119418320 1119418321 
<br/><br/><label>Standard No.: </label>10.1002/9781119418344  doi 
<br/><br/><label>LCCN: </label>2021039115 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronic packaging.
<br/><br/><label>Index Terms--Genre/Form: </label><br/>Electronic books.
<br/><br/><label>LC Class. No.: </label>TK7870.15 
<br/><br/><label>Dewey Class. No.: </label>621.381/046