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Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC / Er-Ping Li.

by Li, Er-Ping [author.] | IEEE Xplore (Online Service) [distributor.] | Wiley InterScience (Online service) [publisher.].

Material type: book Book; Format: available online remote Publisher: [United States] : Hoboken [New Jersey] : IEEE Press ; Wiley, Distributor: [Piscataqay, New Jersey] : IEEE Xplore, [2012]Online access: Abstract with links to resource Availability: No items available

Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC / Er-Ping Li.

by Li, Er-Ping [author.] | IEEE Xplore (Online Service) [distributor.] | Wiley InterScience (Online service) [publisher.].

Material type: book Book; Format: available online remote Publisher: [United States] : Hoboken [New Jersey] : IEEE Press ; Wiley, Distributor: [Piscataqay, New Jersey] : IEEE Xplore, [2012]Online access: Abstract with links to resource Availability: No items available

Plasmonic nanoelectronics and sensing / by Er-Ping Li, Hong-Son Chu.

by Li, Er-Ping [author.] | Chu, Hong-Son [author.].

Material type: book Book; Format: available online remote; Literary form: Not fiction Publisher: Cambridge : Cambridge University Press, 2014Other title: Plasmonic nanoelectronics & sensing.Online access: Click here to access online Availability: No items available