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Advanced Flip Chip Packaging [electronic resource] / edited by Ho-Ming Tong, Yi-Shao Lai, C.P. Wong.

by Tong, Ho-Ming [editor.] | Lai, Yi-Shao [editor.] | Wong, C.P [editor.] | SpringerLink (Online service).

Source: Springer eBooksMaterial type: book Book; Format: electronic available online remote; Literary form: Not fiction Publisher: Boston, MA : Springer US : Imprint: Springer, 2013Online access: Click here to access online Availability: No items available

Materials for Advanced Packaging [electronic resource] / edited by Daniel Lu, C.P. Wong.

by Lu, Daniel [editor.] | Wong, C.P [editor.] | SpringerLink (Online service).

Edition: 2nd ed. 2017.Source: Springer Nature eBookMaterial type: book Book; Format: electronic available online remote; Literary form: Not fiction Publisher: Cham : Springer International Publishing : Imprint: Springer, 2017Online access: Click here to access online Availability: No items available