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Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces [electronic resource] / by Qingke Zhang.

by Zhang, Qingke [author.] | SpringerLink (Online service).

Source: Springer eBooksMaterial type: book Book; Format: electronic available online remote; Literary form: Not fiction Publisher: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2016Online access: Click here to access online Availability: No items available

Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces [electronic resource] / by Qingke Zhang.

by Zhang, Qingke [author.] | SpringerLink (Online service).

Edition: 1st ed. 2016.Source: Springer Nature eBookMaterial type: book Book; Format: electronic available online remote; Literary form: Not fiction Publisher: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2016Online access: Click here to access online Availability: No items available