000 04336nam a22006015i 4500
001 978-3-319-12862-7
003 DE-He213
005 20200420220219.0
007 cr nn 008mamaa
008 141120s2015 gw | s |||| 0|eng d
020 _a9783319128627
_9978-3-319-12862-7
024 7 _a10.1007/978-3-319-12862-7
_2doi
050 4 _aTK7800-8360
050 4 _aTK7874-7874.9
072 7 _aTJF
_2bicssc
072 7 _aTEC008000
_2bisacsh
072 7 _aTEC008070
_2bisacsh
082 0 4 _a621.381
_223
245 1 0 _aMolecular Modeling and Multiscaling Issues for Electronic Material Applications
_h[electronic resource] :
_bVolume 2 /
_cedited by Artur Wymyslowski, Nancy Iwamoto, Matthew Yuen, Haibo Fan.
264 1 _aCham :
_bSpringer International Publishing :
_bImprint: Springer,
_c2015.
300 _aX, 194 p. 153 illus., 77 illus. in color.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
505 0 _aMolecular Modeling of pH-Dependent Properties of Emeraldine Base Polyaniline for pH-Based Chemical Sensors -- Two Approaches of Study Cu/Epoxy Interface Enhancement with Benzenethiol Promoter -- Molecular Dynamics Simulation of Pore Formation Mechanism for Deposition of Poly (vinylidene fluoride-co-trifluoroethylene) on Gold Substrate -- Investigating the Influence of Moisture by Molecular Dynamics Simulations -- Analysis of the Adhesion Work with a Molecular Modeling Method and a Wetting Angle Measurement -- Using Coarse-Grained Molecular Models (Molecular-Mesocale) of a Copper Oxide-Epoxy Interface to Obtain Stress-Strain Failure Predictions which Include Interfacial Roughness, Water and Filler Effects -- Establishment of the Mesoscale Parameters for Separation: A Non-Equilibrium Molecular Dynamics Model -- Mechanics of Graphene and Carbon Nanotubes under Uniaxial Compression and Tension -- Analysis of an Influence of a Conversion Level on Simulation Results of the Crosslinked Polymers.
520 _aThis book offers readers a snapshot of the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand materials to solve relevant issues in this field. The reader is introduced to the evolving role of molecular modeling, especially seen from the perspective of the IEEE community and modeling in electronics. This book also covers the aspects of molecular modeling needed to understand the relationship between structures and mechanical performance of materials. The authors also discuss the transitional topic of multiscale modeling and recent developments on the atomistic scale and current attempts to reach the submicron scale, as well as the role that quantum mechanics can play in performance prediction. This book also: Discusses multiscale modeling of materials at the mesoscale Highlights current state-of-the-art, novel research topics and achievements in the area of molecular modelling and multiscaling problems of electronic materials and their applications as well as atomistic modeling of mechanical properties Provides practical examples for engineers interested in molecular modeling using simulations drawn from electronic packaging, dielectric materials, and thermal and mechanical properties.
650 0 _aEngineering.
650 0 _aNanoscale science.
650 0 _aNanoscience.
650 0 _aNanostructures.
650 0 _aContinuum mechanics.
650 0 _aElectronics.
650 0 _aMicroelectronics.
650 0 _aOptical materials.
650 0 _aElectronic materials.
650 1 4 _aEngineering.
650 2 4 _aElectronics and Microelectronics, Instrumentation.
650 2 4 _aContinuum Mechanics and Mechanics of Materials.
650 2 4 _aOptical and Electronic Materials.
650 2 4 _aNanoscale Science and Technology.
700 1 _aWymyslowski, Artur.
_eeditor.
700 1 _aIwamoto, Nancy.
_eeditor.
700 1 _aYuen, Matthew.
_eeditor.
700 1 _aFan, Haibo.
_eeditor.
710 2 _aSpringerLink (Online service)
773 0 _tSpringer eBooks
776 0 8 _iPrinted edition:
_z9783319128610
856 4 0 _uhttp://dx.doi.org/10.1007/978-3-319-12862-7
912 _aZDB-2-ENG
942 _cEBK
999 _c51759
_d51759