000 02891nam a22005295i 4500
001 978-3-662-48823-2
003 DE-He213
005 20200421111203.0
007 cr nn 008mamaa
008 151031s2016 gw | s |||| 0|eng d
020 _a9783662488232
_9978-3-662-48823-2
024 7 _a10.1007/978-3-662-48823-2
_2doi
050 4 _aTA349-359
072 7 _aTGB
_2bicssc
072 7 _aSCI041000
_2bisacsh
072 7 _aTEC009070
_2bisacsh
082 0 4 _a620.1
_223
100 1 _aZhang, Qingke.
_eauthor.
245 1 0 _aInvestigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
_h[electronic resource] /
_cby Qingke Zhang.
264 1 _aBerlin, Heidelberg :
_bSpringer Berlin Heidelberg :
_bImprint: Springer,
_c2016.
300 _aXV, 143 p. 115 illus., 81 illus. in color.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
490 1 _aSpringer Theses, Recognizing Outstanding Ph.D. Research,
_x2190-5053
505 0 _aResearch Progress in Pb-free Soldering -- Fracture Behavior of IMCs at Cu/Pb-free Solder Interface -- Tensile-compress Fatigue Behavior of Solder Joints -- Shear Creep-fatigue Behavior of Cu/Pb-free Solder Joints -- Thermal Fatigue Behavior of Sn-Ag/Cu Solder Joints -- Conclusions.
520 _aThis thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.
650 0 _aEngineering.
650 0 _aStructural mechanics.
650 0 _aMaterials science.
650 0 _aMaterials
_xSurfaces.
650 0 _aThin films.
650 1 4 _aEngineering.
650 2 4 _aStructural Mechanics.
650 2 4 _aSurfaces and Interfaces, Thin Films.
650 2 4 _aClassical Mechanics.
650 2 4 _aCharacterization and Evaluation of Materials.
710 2 _aSpringerLink (Online service)
773 0 _tSpringer eBooks
776 0 8 _iPrinted edition:
_z9783662488218
830 0 _aSpringer Theses, Recognizing Outstanding Ph.D. Research,
_x2190-5053
856 4 0 _uhttp://dx.doi.org/10.1007/978-3-662-48823-2
912 _aZDB-2-ENG
942 _cEBK
999 _c53961
_d53961