000 02838nam a22005655i 4500
001 978-981-4451-21-5
003 DE-He213
005 20200421111649.0
007 cr nn 008mamaa
008 130321s2013 si | s |||| 0|eng d
020 _a9789814451215
_9978-981-4451-21-5
024 7 _a10.1007/978-981-4451-21-5
_2doi
050 4 _aTA169.7
050 4 _aT55-T55.3
050 4 _aTA403.6
072 7 _aTGPR
_2bicssc
072 7 _aTEC032000
_2bisacsh
082 0 4 _a658.56
_223
100 1 _aTan, Cher Ming.
_eauthor.
245 1 0 _aElectromigration Modeling at Circuit Layout Level
_h[electronic resource] /
_cby Cher Ming Tan, Feifei He.
264 1 _aSingapore :
_bSpringer Singapore :
_bImprint: Springer,
_c2013.
300 _aIX, 103 p. 75 illus., 2 illus. in color.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
490 1 _aSpringerBriefs in Applied Sciences and Technology,
_x2191-530X
505 0 _aIntroduction -- 3D Circuit Model Construction and Simulation -- Comparison of EM Performance in Circuit Structure and Test Structure -- Interconnect EM Reliability Modeling at Circuit Layout Level -- Conclusion.
520 _aIntegrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.  Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level. .
650 0 _aEngineering.
650 0 _aAtoms.
650 0 _aPhysics.
650 0 _aElectronic circuits.
650 0 _aQuality control.
650 0 _aReliability.
650 0 _aIndustrial safety.
650 1 4 _aEngineering.
650 2 4 _aQuality Control, Reliability, Safety and Risk.
650 2 4 _aElectronic Circuits and Devices.
650 2 4 _aAtomic, Molecular, Optical and Plasma Physics.
700 1 _aHe, Feifei.
_eauthor.
710 2 _aSpringerLink (Online service)
773 0 _tSpringer eBooks
776 0 8 _iPrinted edition:
_z9789814451208
830 0 _aSpringerBriefs in Applied Sciences and Technology,
_x2191-530X
856 4 0 _uhttp://dx.doi.org/10.1007/978-981-4451-21-5
912 _aZDB-2-ENG
942 _cEBK
999 _c54284
_d54284