| 000 | 03406nam a22005535i 4500 | ||
|---|---|---|---|
| 001 | 978-1-4614-9266-5 | ||
| 003 | DE-He213 | ||
| 005 | 20200421111656.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 141105s2015 xxu| s |||| 0|eng d | ||
| 020 |
_a9781461492665 _9978-1-4614-9266-5 |
||
| 024 | 7 |
_a10.1007/978-1-4614-9266-5 _2doi |
|
| 050 | 4 | _aTK7800-8360 | |
| 050 | 4 | _aTK7874-7874.9 | |
| 072 | 7 |
_aTJF _2bicssc |
|
| 072 | 7 |
_aTEC008000 _2bisacsh |
|
| 072 | 7 |
_aTEC008070 _2bisacsh |
|
| 082 | 0 | 4 |
_a621.381 _223 |
| 100 | 1 |
_aLee, Tae-Kyu. _eauthor. |
|
| 245 | 1 | 0 |
_aFundamentals of Lead-Free Solder Interconnect Technology _h[electronic resource] : _bFrom Microstructures to Reliability / _cby Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma. |
| 264 | 1 |
_aBoston, MA : _bSpringer US : _bImprint: Springer, _c2015. |
|
| 300 |
_aXIII, 253 p. 151 illus., 81 illus. in color. _bonline resource. |
||
| 336 |
_atext _btxt _2rdacontent |
||
| 337 |
_acomputer _bc _2rdamedia |
||
| 338 |
_aonline resource _bcr _2rdacarrier |
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| 347 |
_atext file _bPDF _2rda |
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| 505 | 0 | _aIntroduction -- Interconnection : The Joint -- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys -- Microstructure Development; Solidification and Isothermal Aging -- Thermal Cycling Performance -- Mechanical Stability and Performance -- Chemical and Environment Attack -- Challenges in Future Generation Interconnects: Microstructure Again. | |
| 520 | _aThis unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution. The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based. In summary, this book: Provides an up-to-date overview on lead-free soldering technologies Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering technique Explores emerging technologies in lead-free soldering. | ||
| 650 | 0 | _aEngineering. | |
| 650 | 0 | _aElectronics. | |
| 650 | 0 | _aMicroelectronics. | |
| 650 | 0 | _aElectronic circuits. | |
| 650 | 0 | _aOptical materials. | |
| 650 | 0 | _aElectronic materials. | |
| 650 | 1 | 4 | _aEngineering. |
| 650 | 2 | 4 | _aElectronics and Microelectronics, Instrumentation. |
| 650 | 2 | 4 | _aOptical and Electronic Materials. |
| 650 | 2 | 4 | _aCircuits and Systems. |
| 700 | 1 |
_aBieler, Thomas R. _eauthor. |
|
| 700 | 1 |
_aKim, Choong-Un. _eauthor. |
|
| 700 | 1 |
_aMa, Hongtao. _eauthor. |
|
| 710 | 2 | _aSpringerLink (Online service) | |
| 773 | 0 | _tSpringer eBooks | |
| 776 | 0 | 8 |
_iPrinted edition: _z9781461492658 |
| 856 | 4 | 0 | _uhttp://dx.doi.org/10.1007/978-1-4614-9266-5 |
| 912 | _aZDB-2-ENG | ||
| 942 | _cEBK | ||
| 999 |
_c54675 _d54675 |
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