000 03785nam a22005295i 4500
001 978-1-4614-5761-9
003 DE-He213
005 20200421111657.0
007 cr nn 008mamaa
008 130919s2014 xxu| s |||| 0|eng d
020 _a9781461457619
_9978-1-4614-5761-9
024 7 _a10.1007/978-1-4614-5761-9
_2doi
050 4 _aTJ163.12
072 7 _aTDPB
_2bicssc
072 7 _aTEC009070
_2bisacsh
072 7 _aTEC008070
_2bisacsh
082 0 4 _a629.8
_223
100 1 _aChauhan, Preeti S.
_eauthor.
245 1 0 _aCopper Wire Bonding
_h[electronic resource] /
_cby Preeti S Chauhan, Anupam Choubey, ZhaoWei Zhong, Michael G Pecht.
264 1 _aNew York, NY :
_bSpringer New York :
_bImprint: Springer,
_c2014.
300 _aXXVI, 235 p. 104 illus., 20 illus. in color.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
505 0 _aCopper Wire Bonding -- Bonding Process -- Bonding Metallurgies -- Wire Bond Evaluation -- Thermal Reliability Tests -- Humidity and Electromigration Tests -- Wire Bond Pads -- Concerns and Solutions -- Recommendations -- Appendix A: Reliability Data -- Appendix B: Patents on Copper Wire Bonding.
520 _aThis critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks.  Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material.  However, copper wire bonding has several process and reliability concerns due to its material properties.  Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes-bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation.  In addition, the bond-pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed.  The book also discusses best practices and recommendations on the bond process, bond-pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond-pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry  Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.
650 0 _aEngineering.
650 0 _aMechatronics.
650 0 _aIndustrial engineering.
650 0 _aOptical materials.
650 0 _aElectronic materials.
650 1 4 _aEngineering.
650 2 4 _aMechatronics.
650 2 4 _aOperating Procedures, Materials Treatment.
650 2 4 _aOptical and Electronic Materials.
700 1 _aChoubey, Anupam.
_eauthor.
700 1 _aZhong, ZhaoWei.
_eauthor.
700 1 _aPecht, Michael G.
_eauthor.
710 2 _aSpringerLink (Online service)
773 0 _tSpringer eBooks
776 0 8 _iPrinted edition:
_z9781461457602
856 4 0 _uhttp://dx.doi.org/10.1007/978-1-4614-5761-9
912 _aZDB-2-ENG
942 _cEBK
999 _c54787
_d54787