| 000 | 02619nam a22004815i 4500 | ||
|---|---|---|---|
| 001 | 978-94-017-9038-3 | ||
| 003 | DE-He213 | ||
| 005 | 20200421111838.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 140511s2014 ne | s |||| 0|eng d | ||
| 020 |
_a9789401790383 _9978-94-017-9038-3 |
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| 024 | 7 |
_a10.1007/978-94-017-9038-3 _2doi |
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| 050 | 4 | _aTK7888.4 | |
| 072 | 7 |
_aTJFC _2bicssc |
|
| 072 | 7 |
_aTEC008010 _2bisacsh |
|
| 082 | 0 | 4 |
_a621.3815 _223 |
| 245 | 1 | 0 |
_aElectrical Design of Through Silicon Via _h[electronic resource] / _cedited by Manho Lee, Jun So Pak, Joungho Kim. |
| 264 | 1 |
_aDordrecht : _bSpringer Netherlands : _bImprint: Springer, _c2014. |
|
| 300 |
_aIX, 280 p. 249 illus. _bonline resource. |
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| 336 |
_atext _btxt _2rdacontent |
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| 337 |
_acomputer _bc _2rdamedia |
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| 338 |
_aonline resource _bcr _2rdacarrier |
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| 347 |
_atext file _bPDF _2rda |
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| 505 | 0 | _aPreface -- 1 Introduction -- 2 Electrical Modeling of a Through-Silicon Via (TSV) -- 3 High-speed TSV-based Channel Modeling and Design -- 4 Noise Coupling and Shielding in 3D ICs -- 5 Thermal Effects on TSV Signal Integrity -- 6 Power Distribution Network (PDN) Modeling and Analysis for TSV and Interposer-based 3D-ICs in the Frequency Domain -- 7 TSV Decoupling Schemes -- Index. | |
| 520 | _aThrough Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity, and even thermal integrity. Most of the analysis in this book include simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have been studied deep into a TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered. | ||
| 650 | 0 | _aEngineering. | |
| 650 | 0 | _aSpecial purpose computers. | |
| 650 | 0 | _aElectronic circuits. | |
| 650 | 1 | 4 | _aEngineering. |
| 650 | 2 | 4 | _aCircuits and Systems. |
| 650 | 2 | 4 | _aElectronic Circuits and Devices. |
| 650 | 2 | 4 | _aSpecial Purpose and Application-Based Systems. |
| 700 | 1 |
_aLee, Manho. _eeditor. |
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| 700 | 1 |
_aPak, Jun So. _eeditor. |
|
| 700 | 1 |
_aKim, Joungho. _eeditor. |
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| 710 | 2 | _aSpringerLink (Online service) | |
| 773 | 0 | _tSpringer eBooks | |
| 776 | 0 | 8 |
_iPrinted edition: _z9789401790376 |
| 856 | 4 | 0 | _uhttp://dx.doi.org/10.1007/978-94-017-9038-3 |
| 912 | _aZDB-2-ENG | ||
| 942 | _cEBK | ||
| 999 |
_c55379 _d55379 |
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