000 04449nam a22005055i 4500
001 978-1-4614-0821-5
003 DE-He213
005 20200421112035.0
007 cr nn 008mamaa
008 141107s2015 xxu| s |||| 0|eng d
020 _a9781461408215
_9978-1-4614-0821-5
024 7 _a10.1007/978-1-4614-0821-5
_2doi
050 4 _aTK7888.4
072 7 _aTJFC
_2bicssc
072 7 _aTEC008010
_2bisacsh
082 0 4 _a621.3815
_223
100 1 _aMoiseev, Konstantin.
_eauthor.
245 1 0 _aMulti-Net Optimization of VLSI Interconnect
_h[electronic resource] /
_cby Konstantin Moiseev, Avinoam Kolodny, Shmuel Wimer.
264 1 _aNew York, NY :
_bSpringer New York :
_bImprint: Springer,
_c2015.
300 _aXVI, 233 p. 124 illus., 44 illus. in color.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
505 0 _aAn Overview of the VLSI Interconnect Problem -- Interconnect Aspects in Design Methodology and EDA Tools -- Scaling Dependent Electrical Modeling of Interconnects -- Net-by-Net Wire Optimization -- Multi-Net Sizing and Spacing of Bundle Wires -- Multi-net Sizing and Spacing in General Layouts -- Interconnect Optimization by Net Ordering -- Layout Migration -- Future Directions in Interconnect Optimization.
520 _aThis book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits.  • Describes the evolution of interconnect scaling and provides new techniques for layout migration and optimization, focusing on multi-net optimization; • Presents research results that provide a level of design optimization which does not exist in commercially-available design automation software tools; • Includes mathematical properties and conditions for optimality of layout, describes and analyses algorithmic solutions, and supplements analysis with examples taken from state-of-the-art chips. This book addresses an intriguing engineering challenge, namely the design of an enormous maze of wires, which run in about a dozen metal layers above billions of transistors in a modern processor. The physical insight, mathematical rigor and methodological approach described in the book, are essential for engineers and computer architects, as they develop new systems of ever-increasing complexity and migrate them to new generations of device technologies.  The Authors of this book didn't only develop the academic methodologies, but actually developed CAD tools, and implemented their tools and methodologies to design VLSI chips. I had the privilege to work with them. --Mooly Eden, Senior Vice President, Intel Corporation; President, Intel Israel The speed, power, area, and reliability of high performance integrated circuits are determined by the on-chip interconnect. With the publication of this book, an important niche has been filled; that is local and global on-chip interconnect optimization. This book provides a theoretical basis for the practical design of the key issue in modern integrated circuits, the on-chip interconnect. --Eby G. Friedman, Distinguished Professor, University of Rochester.
650 0 _aEngineering.
650 0 _aMicroprocessors.
650 0 _aElectronics.
650 0 _aMicroelectronics.
650 0 _aElectronic circuits.
650 1 4 _aEngineering.
650 2 4 _aCircuits and Systems.
650 2 4 _aElectronics and Microelectronics, Instrumentation.
650 2 4 _aProcessor Architectures.
700 1 _aKolodny, Avinoam.
_eauthor.
700 1 _aWimer, Shmuel.
_eauthor.
710 2 _aSpringerLink (Online service)
773 0 _tSpringer eBooks
776 0 8 _iPrinted edition:
_z9781461408208
856 4 0 _uhttp://dx.doi.org/10.1007/978-1-4614-0821-5
912 _aZDB-2-ENG
942 _cEBK
999 _c56336
_d56336