000			03218nam a22005415i 4500
001			978-1-4419-5768-9
003			DE-He213
005			20200421112220.0
007			cr nn 008mamaa
008			130321s2013 xxu| s |||| 0|eng d
020			_a9781441957689 _9978-1-4419-5768-9
024	7		_a10.1007/978-1-4419-5768-9 _2doi
050		4	_aTK7800-8360
050		4	_aTK7874-7874.9
072		7	_aTJF _2bicssc
072		7	_aTEC008000 _2bisacsh
072		7	_aTEC008070 _2bisacsh
082	0	4	_a621.381 _223
245	1	0	_aAdvanced Flip Chip Packaging _h[electronic resource] / _cedited by Ho-Ming Tong, Yi-Shao Lai, C.P. Wong.
264		1	_aBoston, MA : _bSpringer US : _bImprint: Springer, _c2013.
300			_aVII, 560 p. 413 illus., 242 illus. in color. _bonline resource.
336			_atext _btxt _2rdacontent
337			_acomputer _bc _2rdamedia
338			_aonline resource _bcr _2rdacarrier
347			_atext file _bPDF _2rda
505	0		_aFlip Chip Technology Overview and Early Beginnings -- Technology Trends of Flip Chip -- Bumping Technologies -- Flip-Chip Interconnections: Past, Present and Future -- Underfill -- Conductive Adhesives for Flip Chip Applications -- Enabling Substrate Technologies: Past, Present and Future -- IC-Package-System Integrated Design -- Thermal Management of Flip Chip Packages -- Thermo-Mechanical Reliability in Flip Chip Packages --  Interfacial Reactions and Electromigration in Flip-Chip Solder Joints.
520			_aAdvanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also: Offers broad-ranging chapters with a focus on IC-package-system integration Provides viewpoints from leading industry executives and experts Details state-of-the-art achievements in process technologies and scientific research Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.
650		0	_aEngineering.
650		0	_aElectronics.
650		0	_aMicroelectronics.
650		0	_aElectronic circuits.
650		0	_aOptical materials.
650		0	_aElectronic materials.
650	1	4	_aEngineering.
650	2	4	_aElectronics and Microelectronics, Instrumentation.
650	2	4	_aCircuits and Systems.
650	2	4	_aOptical and Electronic Materials.
700	1		_aTong, Ho-Ming. _eeditor.
700	1		_aLai, Yi-Shao. _eeditor.
700	1		_aWong, C.P. _eeditor.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9781441957672
856	4	0	_uhttp://dx.doi.org/10.1007/978-1-4419-5768-9
912			_aZDB-2-ENG
942			_cEBK
999			_c57339 _d57339