000 06652nam a2201501 i 4500
001 5263046
003 IEEE
005 20200421114112.0
006 m o d
007 cr |n|||||||||
008 100317t20152005nju o 000 0 eng d
020 _a9780470544082
_qelectronic
020 _z9780471466093
_qpaper
020 _z0470544082
_qelectronic
024 7 _a10.1109/9780470544082
_2doi
035 _a(CaBNVSL)mat05263046
035 _a(IDAMS)0b000064810c3195
040 _aCaBNVSL
_beng
_erda
_cCaBNVSL
_dCaBNVSL
050 4 _aTK7874
_b.A383 2005eb
082 0 4 _a621.381046
_222
245 0 0 _aAdvanced electronic packaging.
250 _a2nd ed. /
_bedited by William D. Brown, Richard K. Ulrich.
264 1 _aHoboken, New Jersey :
_bWiley,
_c2005.
264 2 _a[Piscataqay, New Jersey] :
_bIEEE Xplore,
_c2009.
300 _a1 PDF (784 pages).
336 _atext
_2rdacontent
337 _aelectronic
_2isbdmedia
338 _aonline resource
_2rdacarrier
490 1 _aIEEE press series on microelectronic systems ;
_v1
500 _aPrevious ed.: New York: IEEE, 1999.
505 0 _aList of Contributors. List of Acronyms. Preface. Introduction and Overview of Microelectronics Packaging (W. Brown). Microelectronics Packaging Materials and Applications (W. Brown). Electrical Design Considerations (S. Ang). Modeling and Simulation (L. Schaper). Thermal Design and Management of Electronics (R. Couvillion). Mechanical Design Considerations (W. Schmidt). Packaging Trade-Offs and Decisions (L. Schaper). Computer-Aided Engineering and Design (D. Andrews, et al.). Processing Technologies in Microelectronic Packaging (H. Naseem). Materials and Processing Considerations (S. Ang & W. Brown). Reliability Considerations (R. Ulrich). Testing and Qualification (S. Kolluru & D. Berleant). Mainframe Packaging: The Thermal Conduction Module (TCM) (T. Lenihan). An Industry Perspective on MCM-D (J. Demmin). Automotive Multichip Modules (R. Johnson & J. Evans). Analyticaln Techniques for Materials Characterization (S. Nasrazadani, et al.). Cost Considerations (E. Malstrom). Advances Topics and Future Trends in MCM Technology (J. Brewer, et al.). Index. About the Editor.
506 1 _aRestricted to subscribers or individual electronic text purchasers.
520 _aPackaging is rapidly becoming an area of microeclectronics technology which can limit the operating speed on an integrated circuit. To address this concern, much research and development attention now focuses on packaging in an effort to prevent it from impeding the speed of electronic systems. With Advanced Electronic Packaging, readers can learn about the full range of packaging concepts, from the introductory to the advanced level, and gain a deeper understanding of this rapidly growing area of microelectronics. As an excellent desk reference for practicing engineers or as an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the fabrication, testing, reliability, and packaging of integrated circuits, specifically, multichip modules (MCM). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design tradeoffs. Also addressed are the critical role of economics and future trends in electronic packaging. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
530 _aAlso available in print.
538 _aMode of access: World Wide Web
588 _aDescription based on PDF viewed 12/21/2015.
650 0 _aMicroelectronic packaging.
655 0 _aElectronic books.
695 _aAdhesives
695 _aAssembly
695 _aAutomotive engineering
695 _aBiographies
695 _aCeramics
695 _aClocks
695 _aComplexity theory
695 _aComputer aided engineering
695 _aComputers
695 _aConductivity
695 _aConductors
695 _aCooling
695 _aCosting
695 _aDelay
695 _aDesign automation
695 _aDielectric materials
695 _aDielectrics
695 _aElectromagnetic interference
695 _aElectronic components
695 _aElectronics packaging
695 _aEngines
695 _aFabrication
695 _aFace
695 _aFailure analysis
695 _aFinite element methods
695 _aForce
695 _aGold
695 _aHardware design languages
695 _aHeat transfer
695 _aHeating
695 _aIndexes
695 _aInductance
695 _aIndustries
695 _aIntegrated circuit interconnections
695 _aIntegrated circuit modeling
695 _aIntegrated circuit technology
695 _aIntegrated circuits
695 _aLattices
695 _aLeg
695 _aLogic gates
695 _aMaintenance engineering
695 _aManufacturing
695 _aMarketing and sales
695 _aMaterials
695 _aMechanical power transmission
695 _aMetals
695 _aMicroassembly
695 _aMicroelectronics
695 _aMultichip modules
695 _aNoise
695 _aPackaging
695 _aPerformance evaluation
695 _aPins
695 _aPlastics
695 _aPolyimides
695 _aPowders
695 _aPower distribution
695 _aProduction
695 _aReliability
695 _aResistance
695 _aScanning electron microscopy
695 _aScattering
695 _aShape
695 _aSilicon
695 _aSoftware
695 _aSolid modeling
695 _aSolids
695 _aStrain
695 _aStrain measurement
695 _aStress
695 _aSubstrates
695 _aSurface topography
695 _aSurface treatment
695 _aTesting
695 _aThermal conductivity
695 _aThermal management of electronics
695 _aThermal stability
695 _aWarranties
695 _aWire
695 _aWiring
695 _aX-ray diffraction
700 1 _aBrown, William D.,
_d1943-
700 1 _aUlrich, Richard K.
_q(Richard Kevin),
_d1955-
710 2 _aJohn Wiley & Sons
_epublisher.
710 2 _aIEEE Xplore (Online service),
_edistributor.
776 0 8 _iPrint version:
_z9780471466093
830 0 _aIEEE press series on microelectronic systems ;
_v1
856 4 2 _3Abstract with links to resource
_uhttp://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5263046
942 _cEBK
999 _c59382
_d59382