000 04598nam a2200937 i 4500
001 5453758
003 IEEE
005 20200421114118.0
006 m o d
007 cr |n|||||||||
008 151221s2010 njua ob 001 eng d
020 _a9780470824092
_qelectronic
020 _z9780470824078
_qprint
020 _z0470824093
_qelectronic
024 7 _a10.1002/9780470824092
_2doi
035 _a(CaBNVSL)mat05453758
035 _a(IDAMS)0b00006481237fee
040 _aCaBNVSL
_beng
_erda
_cCaBNVSL
_dCaBNVSL
050 4 _aTK7871.99.M44
_bK47 2009eb
082 0 4 _a621.39/5
_222
100 1 _aKer, Ming-Dou,
_eauthor.
245 1 0 _aTransient-induced latchup in CMOS integrated circuits /
_cMing-Dou Ker and Sheng-Fu Hsu.
264 1 _aSingapore ;
_bWiley,
_cc2009.
264 2 _a[Piscataqay, New Jersey] :
_bIEEE Xplore,
_c[2010]
300 _a1 PDF (xiii, 249 pages) :
_billustrations.
336 _atext
_2rdacontent
337 _aelectronic
_2isbdmedia
338 _aonline resource
_2rdacarrier
504 _aIncludes bibliographical references and index.
505 0 _aPhysical Mechanism of TLU under the System-Level ESD Test -- Component-Level Measurement for TLU under System-Level ESD Considerations -- TLU Dependency on Power-Pin Damping Frequency and Damping Factor in CMOS Integrated Circuits -- TLU in CMOS ICs in the Electrical Fast Transient Test -- Methodology on Extracting Compact Layout Rules for Latchup Prevention -- Special Layout Issues for Latchup Prevention -- TLU Prevention in Power-Rail ESD Clamp Circuits -- Appendix A: Practical Application Extractions of Latchup Design Rules in a 0.18-mm 1.8 V/3.3V Silicided CMOS Process.
506 1 _aRestricted to subscribers or individual electronic text purchasers.
520 _a"Transient-Induced Latchup in CMOS Integrated Circuits equips the practicing engineer with all the tools needed to address this regularly occurring problem while becoming more proficient at IC layout. Ker and Hsu introduce the phenomenon and basic physical mechanism of latchup, explaining the critical issues that have resurfaced for CMOS technologies. Once readers can gain an understanding of the standard practices for TLU, Ker and Hsu discuss the physical mechanism of TLU under a system-level ESD test, while introducing an efficient component-level TLU measurement setup. The authors then present experimental methodologies to extract safe and area-efficient compact layout rules for latchup prevention, including layout rules for I/O cells, internal circuits, and between I/O and internal circuits. The book concludes with an appendix giving a practical example of extracting layout rules and guidelines for latchup prevention in a 0.18-micrometer 1.8V/3.3V silicided CMOS process."--Publisher's description.
530 _aAlso available in print.
538 _aMode of access: World Wide Web
550 _aMade available online by Ebrary.
588 _aDescription based on PDF viewed 12/21/2015.
650 0 _aMetal oxide semiconductors, Complementary
_xDefects.
650 0 _aMetal oxide semiconductors, Complementary
_xReliability.
655 0 _aElectronic books.
695 _aCMOS integrated circuits
695 _aCMOS process
695 _aCMOS technology
695 _aClamps
695 _aConferences
695 _aCurrent measurement
695 _aDamping
695 _aElectric breakdown
695 _aElectrical resistance measurement
695 _aElectrostatic discharge
695 _aFrequency measurement
695 _aGuidelines
695 _aIndexes
695 _aIntegrated circuit modeling
695 _aIntegrated circuit reliability
695 _aInverters
695 _aJunctions
695 _aLayout
695 _aLogic gates
695 _aMOS devices
695 _aNoise
695 _aPerformance evaluation
695 _aPins
695 _aPulse measurements
695 _aResistance
695 _aRobustness
695 _aSemiconductor device modeling
695 _aStress
695 _aSystem-on-a-chip
695 _aTesting
695 _aThyristors
695 _aTime frequency analysis
695 _aTransient analysis
695 _aVoltage control
695 _aVoltage measurement
700 1 _aHsu, Sheng-Fu.
710 2 _aJohn Wiley & Sons,
_epublisher.
710 2 _aIEEE Xplore (Online service),
_edistributor.
776 0 8 _iPrint version:
_z9780470824078
856 4 2 _3Abstract with links to resource
_uhttp://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5453758
942 _cEBK
999 _c59642
_d59642