000 04273cam a22005658i 4500
001 on1019839869
003 OCoLC
005 20220711203251.0
006 m o d
007 cr |n|||||||||
008 180108s2018 nju ob 001 0 eng
010 _a 2018000679
040 _aDLC
_beng
_erda
_cDLC
_dOCLCO
_dOCLCF
_dOCLCQ
_dDG1
_dMERER
_dUIU
_dUAB
_dUPM
_dOCLCQ
_dSTF
_dWYU
_dLVT
020 _a9781119289678
_q(pdf)
020 _a111928967X
_q(pdf)
020 _a9781119289661
_q(epub)
020 _a1119289661
_q(epub)
020 _a9781119289654
_q(electronic bk. : oBook)
020 _a1119289653
_q(electronic bk. : oBook)
020 _z9781119289647
_q(cloth)
029 1 _aGBVCP
_b101926067X
029 1 _aCHVBK
_b516426885
029 1 _aCHNEW
_b001003061
035 _a(OCoLC)1019839869
042 _apcc
050 1 0 _aTK5103.2
082 0 0 _a621.39/5
_223
049 _aMAIN
100 1 _aHwang, Lih-Tyng,
_eauthor.
_95961
245 1 0 _a3D IC and RF SiPs :
_badvanced stacking and planar solutions for 5G mobility /
_cby Professor Lih-Tyng Hwang, Professor Tzyy-Sheng Jason Horng.
250 _a1st edition.
263 _a1806
264 1 _aHoboken, NJ :
_bJohn Wiley & Sons,
_c2018.
300 _a1 online resource
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
505 0 _aFront Matter -- MM and MTM for Mobility -- Interconnects -- State-of-the-Art IC Packages, Modules, and Substrates -- Passives Technology -- Electrical Design for 5G Hardware-Digital Focus -- Electrical Design for 5G Hardware-RF Focus -- Product, Process Development, and Control -- Product Life and Reliability Assessment -- Hardware Solutions for 5G Mobility -- Appendices. A. Failure Mechanisms and Failure Analysis -- B. ANOVA -- C. Gauge R&R and DOE -- D. Statistics Tables -- Index
504 _aIncludes bibliographical references and index.
588 0 _aPrint version record and CIP data provided by publisher; resource not viewed.
520 _a3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility Lih-Tyng Hwang, National Sun Yat-Sen University, Taiwan, Jason Tzyy-Sheng Horng, National Sun Yat-Sen University, Taiwan A concise summary of the state of the art, this book is an interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments. Readers are introduced to the markets, technology drivers, integrated circuits, packaging and substrate trends that go hand-in-hand with the development of 3D IC and RF SiP, as well as related digital and RF designs, and product life and reliability assessments. Smart phone tear-down is used to illustrate the key components for mobility (4G and future 5G), such as AP/mobile memory and RFIC/RF FE. Other essential topics include packaging technology, high density logic design, RF system integration and future trends℗¿in MTM technology. . Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility. Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft¿́¿s Excel and Minitab. Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail. Provides chapter-wise review questions and powerpoint slides as teaching tools 3D IC and RF SiPs offers graduate students and researchers an essential guide to advanced stacking and planar solutions for 5G mobility. It can also be used as a reference text for engineers and advanced students of semiconductors, communications hardware, and IC packaging technologies.
650 0 _aMobile communication systems
_xTechnological innovations.
_95962
650 7 _aMobile communication systems
_xTechnological innovations.
_2fast
_0(OCoLC)fst01024219
_95962
655 4 _aElectronic books.
_93294
700 1 _aHorng, Tzyy-sheng Jason,
_eauthor.
_95963
776 0 8 _iPrint version:
_aHwang, Lih-Tyng.
_t3D IC and RF SiPs.
_b1st edition.
_dHoboken, NJ : John Wiley & Sons, 2018
_z9781119289647
_w(DLC) 2017052146
856 4 0 _uhttps://doi.org/10.1002/9781119289654
_zWiley Online Library
942 _cEBK
994 _a92
_bDG1
999 _c68570
_d68570