| 000 | 04547cam a2200517Ii 4500 | ||
|---|---|---|---|
| 001 | on1086380840 | ||
| 003 | OCoLC | ||
| 005 | 20220711203503.0 | ||
| 006 | m o d | ||
| 007 | cr cnu|||unuuu | ||
| 008 | 190220s2019 si ob 001 0 eng d | ||
| 040 |
_aDG1 _beng _erda _epn _cDG1 _dEBLCP _dOCLCF _dYDX _dOCLCQ |
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| 020 |
_a9781118956847 _q(electronic bk. ; _qoBook) |
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| 020 |
_a1118956842 _q(electronic bk. ; _qoBook) |
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| 020 |
_z9781118956823 _q(print) |
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| 024 | 7 |
_a10.1002/9781118956847 _2doi |
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| 029 | 1 |
_aAU@ _b000065194497 |
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| 029 | 1 |
_aCHNEW _b001039349 |
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| 029 | 1 |
_aCHVBK _b559028121 |
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| 035 | _a(OCoLC)1086380840 | ||
| 050 | 4 |
_aTK7867.2 _b.Z44 2019eb |
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| 082 | 0 | 4 |
_a621.38 _223 |
| 049 | _aMAIN | ||
| 100 | 1 |
_aZheng, Junqi, _d1975- _eauthor. _98138 |
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| 245 | 1 | 0 |
_aElectromagnetic compatibility (EMC) design and test case analysis / _cJunqi Zheng. |
| 264 | 1 |
_aSingapore : _bWiley, _c2019. |
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| 300 | _a1 online resource | ||
| 336 |
_atext _btxt _2rdacontent |
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| 337 |
_acomputer _bc _2rdamedia |
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| 338 |
_aonline resource _bcr _2rdacarrier |
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| 504 | _aIncludes bibliographical references and index. | ||
| 588 | 0 | _aOnline resource; title from PDF title page (John Wiley, viewed February 20, 2019). | |
| 505 | 0 | _aIntro; Title Page; Copyright Page; Contents; Preface; Exordium; Introduction; Chapter 1 The EMC Basic Knowledge and the Essence of the EMC Test; 1.1 What Is EMC?; 1.2 Conduction, Radiation, and Transient; 1.3 Theoretical Basis; 1.3.1 Time Domain and Frequency Domain; 1.3.2 The Concept of the Unit for Electromagnetic Disturbance, dB; 1.3.3 The True Meaning of Decibel; 1.3.4 Electric Field, Magnetic Field, and Antennas; 1.3.5 Resonance of the RLC Circuit; 1.4 Common Mode and Differential Mode in the EMC Domain; 1.5 Essence of the EMC Test; 1.5.1 Essence of the Radiated Emission Test | |
| 505 | 8 | _a1.5.2 Essence of the Conducted Emission Test1.5.3 Essence of the ESD Immunity Test; 1.5.4 Essence of the Radiated Immunity Test; 1.5.5 Essence of the Common-Mode Conducted Immunity Test; 1.5.6 Essence of the Differential-Mode Conducted Immunity Test; 1.5.7 Differential-Mode and Common-Mode Hybrid Conducted Immunity Test; Chapter 2 Architecture, Shielding, and Grounding Versus EMC of the Product; 2.1 Introduction; 2.1.1 Architecture Versus EMC of the Product; 2.1.2 Shielding Versus EMC of the Product; 2.1.3 Grounding Versus EMC of the Product; 2.2 Analyses of Related Cases | |
| 505 | 8 | _a2.2.1 Case 1: The Conducted Disturbance and the Grounding2.2.2 Case 2: The Ground Loop During the Conducted Emission Test; 2.2.3 Case 3: Where the Radiated Emission Outside the Shield Comes From; 2.2.4 Case 4: The "Floating" Metal and the Radiation; 2.2.5 Case 5: Radiated Emission Caused by the Bolt Extended Outside the Shield; 2.2.6 Case 6: The Compression Amount of the Shield and Its Shielding Effectiveness; 2.2.7 Case 7: The EMI Suppression Effectiveness of the Shielding Layer Between the Transformer's Primary Winding and Secondary Winding in the Switching-Mode Power Supply | |
| 505 | 8 | _a2.2.8 Case 8: Bad Contact of the Metallic Casing and System Reset2.2.9 Case 9: ESD Discharge and the Screw; 2.2.10 Case 10: Heatsink Also Affects the ESD Immunity; 2.2.11 Case 11: How Grounding Benefits EMC Performance; 2.2.12 Case 12: The Heatsink Shape Affects Conducted Emissions from the Power Ports; 2.2.13 Case 13: The Metallic Casing Oppositely Causes the EMI Test Failed; 2.2.14 Case 14: Whether Directly Connecting the PCB Reference Ground to the Metallic Casing Will Lead to ESD | |
| 505 | 8 | _a2.2.15 Case 15: How to Interconnect the Digital Ground and the Analog Ground in the Digital-Analog Mixed DevicesChapter 3 EMC Issues with Cables, Connectors, and Interface Circuits; 3.1 Introduction; 3.1.1 Cable Is the Weakest Link in the System; 3.1.2 The Interface Circuit Provides Solutions to the Cable Radiation Problem; 3.1.3 Connectors Are the Path Between the Interface Circuit and the Cable; 3.1.4 The Interconnection Between the PCBs Is the Weakest Link of the Product EMC; 3.2 Analyses of Related Cases; 3.2.1 Case 16: The Excessive Radiation Caused by the Cabling | |
| 650 | 0 |
_aElectromagnetic compatibility. _97508 |
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| 650 | 0 |
_aElectromagnetic interference. _96583 |
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| 650 | 7 |
_aElectromagnetic compatibility. _2fast _0(OCoLC)fst00906512 _97508 |
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| 650 | 7 |
_aElectromagnetic interference. _2fast _0(OCoLC)fst00906551 _96583 |
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| 655 | 4 |
_aElectronic books. _93294 |
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| 856 | 4 | 0 |
_uhttps://doi.org/10.1002/9781118956847 _zWiley Online Library |
| 942 | _cEBK | ||
| 994 |
_a92 _bDG1 |
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| 999 |
_c69027 _d69027 |
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