| 000 | 03560cam a2200577 i 4500 | ||
|---|---|---|---|
| 001 | on1150801725 | ||
| 003 | OCoLC | ||
| 005 | 20220711203607.0 | ||
| 006 | m o d | ||
| 007 | cr ||||||||||| | ||
| 008 | 200131t20202020njua ob 001 0 eng | ||
| 010 | _a 2020004970 | ||
| 040 |
_aDLC _beng _erda _cDLC _dOCLCO _dOCLCQ _dOCLCF _dUKAHL _dDG1 _dYDX _dN$T |
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| 019 | _a1162342677 | ||
| 020 |
_a9781119482093 _qelectronic book _qoBook |
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| 020 |
_a1119482097 _qelectronic book _qoBook |
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| 020 |
_a1119482046 _qadobe electronic book |
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| 020 |
_a9781119482048 _q(electronic bk.) |
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| 020 |
_z9781119481935 _qelectronic publication |
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| 020 |
_z1119481937 _qelectronic publication |
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| 020 |
_z9781119482031 _qhardcover |
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| 029 | 1 |
_aAU@ _b000067018513 |
|
| 035 |
_a(OCoLC)1150801725 _z(OCoLC)1162342677 |
||
| 042 | _apcc | ||
| 050 | 4 |
_aTK7870.15 _b.L434 2020 |
|
| 082 | 0 | 0 |
_a621.381/046 _223 |
| 049 | _aMAIN | ||
| 245 | 0 | 0 |
_aLead-free soldering process development and reliability / _cedited by Jasbir Bath, Bath Consultancy LLC. |
| 264 | 1 |
_aHoboken, NJ, USA : _bJohn Wiley & Sons, Inc., _c2020. |
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| 264 | 4 | _c©2020 | |
| 300 |
_a1 online resource (xxii, 481 pages) : _billustrations |
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| 336 |
_atext _btxt _2rdacontent |
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| 337 |
_acomputer _bn _2rdamedia |
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| 338 |
_aonline resource _bnc _2rdacarrier |
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| 490 | 1 | _aWiley series in quality & reliability engineering | |
| 504 | _aIncludes bibliographical references and index. | ||
| 520 |
_a"This book discusses ongoing issues in electronics manufacturing production. Each topic is discussed by those who have conducted work in the field and can provide insight into what are the most important areas to consider. The book gives updates in areas for which research is ongoing, and addresses new topics which are relevant to lead-free soldering. Among the key topics the book highlights are emerging environmental legislation, developments in process engineering, alloys, PCB surface finishes, PCB laminates, reliability assessments and standards. A practicing engineer will find the book of use as it goes into these and other topics in sufficient detail to make it informative and a good practical guide to address issues of concern in these areas. Investigates high temperature, low temperature, and high reliability lead-free alloys. Describes the effects of intermetallic compound on reliability. Explains updates in lead-free rework technology including hand soldering, BGA rework, and PTH rework. Provides a guideline to going lead-free to industries that are complying with new environmental regulations, such as defense, aerospace, medical, and automotive industries"-- _cProvided by publisher. |
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| 588 | _aDescription based on online resource; title from digital title page (viewed on August 04, 2020). | ||
| 590 |
_aJohn Wiley and Sons _bWiley Frontlist Obook All English 2020 |
||
| 650 | 0 |
_aElectronic packaging. _99119 |
|
| 650 | 0 |
_aSolder and soldering. _99120 |
|
| 650 | 7 |
_aElectronic packaging. _2fast _0(OCoLC)fst00907414 _99119 |
|
| 650 | 7 |
_aSolder and soldering. _2fast _0(OCoLC)fst01125221 _99120 |
|
| 655 | 4 |
_aElectronic books. _93294 |
|
| 700 | 1 |
_aBath, Jasbir, _eeditor. _99121 |
|
| 776 | 0 | 8 |
_iPrint version: _tLead-free soldering process development and reliability _bFirst edition. _dHoboken, NJ : John Wiley & Sons, Inc., 2020. _z9781119482031 _w(DLC) 2020004969 |
| 830 | 0 |
_aWiley series in quality and reliability engineering. _98055 |
|
| 856 | 4 | 0 |
_uhttps://doi.org/10.1002/9781119482093 _zWiley Online Library |
| 942 | _cEBK | ||
| 994 |
_a92 _bDG1 |
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| 999 |
_c69292 _d69292 |
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