000			02971cam a22005538i 4500
001			on1268544247
003			OCoLC
005			20220711203734.0
006			m o d
007			cr |||||||||||
008			210916s2022 nju ob 001 0 eng
010			_a 2021039115
040			_aDLC _beng _erda _cDLC _dOCLCO _dDG1 _dOCLCO
020			_a9781119418344 _q(electronic bk. : oBook)
020			_a1119418348 _q(electronic bk. : oBook)
020			_a9781119418337 _q(epub)
020			_a111941833X _q(epub)
020			_a9781119418320 _q(adobe pdf)
020			_a1119418321 _q(adobe pdf)
020			_z9781119418313 _q(cloth)
024	7		_a10.1002/9781119418344 _2doi
029	1		_aAU@ _b000069923991
035			_a(OCoLC)1268544247
042			_apcc
050	0	0	_aTK7870.15
082	0	0	_a621.381/046 _223
049			_aMAIN
100	1		_aTu, K. N. _q(King-Ning), _d1937- _eauthor. _910429
245	1	0	_aElectronic packaging science and technology / _cKing-Ning Tu, University of California, Los Angeles, United States of America; Chih Chen, National Chiao Tung University, Hsinchu, Taiwain; Hung-Ming Chen, National Chiao Tung University, Hsinchu, Taiwain.
250			_a1st edition.
263			_a2111
264		1	_aHoboken, NJ : _bWiley, _c2022.
300			_a1 online resource
336			_atext _btxt _2rdacontent
337			_acomputer _bc _2rdamedia
338			_aonline resource _bcr _2rdacarrier
504			_aIncludes bibliographical references and index.
520			_a"This book focuses on modern technology and how electronic packaging plays a major role in moving technology forward. With the enhancement of mobile technology and its challenges, the need for packing technology solutions is evident. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology"-- _cProvided by publisher.
588			_aDescription based on print version record and CIP data provided by publisher; resource not viewed.
590			_bWiley Frontlist Obook All English 2021
650		0	_aElectronic packaging. _99119
655		4	_aElectronic books. _93294
700	1		_aChen, Chih, _d1970- _eauthor. _910430
700	1		_aChen, Hung-Ming, _eauthor. _910431
776	0	8	_iPrint version: _aTu, K. N. 1937- _tElectronic packaging science and technology _b1st edition. _dHoboken, NJ : Wiley, 2022 _z9781119418313 _w(DLC) 2021039114
856	4	0	_uhttps://doi.org/10.1002/9781119418344 _zWiley Online Library
942			_cEBK
994			_a92 _bDG1
999			_c69708 _d69708