000 01710cam a2200361Ii 4500
001 9781315364926
008 180331t20172017si ad ob 001 0 eng d
020 _a9781315364926
_q(e-book : PDF)
020 _a9789814613736
_q(e-book: PDF)
020 _a9781315322308
_q(e-book: Mobi)
020 _z9789814613729
_q(hardback)
024 7 _a10.1201/9781315364926
_2doi
035 _a(OCoLC)982121322
040 _aFlBoTFG
_cFlBoTFG
_erda
050 4 _aTK7875
_b.P35 2017
082 0 4 _a621.381
_bP153
100 1 _aPal, Prem,
_eauthor.
_920120
245 1 0 _aSilicon wet bulk micromachining for MEMS /
_cPrem Pal, Kazuo Sato.
246 3 _aSilicon wet bulk micromachining for microelectromechanical systems
264 1 _aSingapore :
_bPan Stanford Publishing Pte. Ltd.,
_c[2017]
264 4 _c©2017
300 _a1 online resource
336 _atext
_2rdacontent
337 _acomputer
_2rdamedia
338 _aonline resource
_2rdacarrier
505 0 _a1. A brief introduction of the crystal structure -- 2. Brief overview of silicon wafer manufacturing and microfabrication techniques -- 3. Isotropic etching of silicon and related materials -- 4. KOH-based anisotropic etching -- 5. TMAH-based anisotropic etching -- 6. Convex and concave corners in silicon wet bulk micromachining -- 7. Alignment of mask patterns to crystallographic directions -- 8. Simple to complex structures using wet bulk micromachining.
650 0 _aMicroelectromechanical systems.
_96063
650 0 _aMicromachining.
_912531
700 1 _aSato, Kazuo,
_eauthor.
_920121
776 0 8 _iPrint version:
_z9789814613729
856 4 0 _uhttps://www.taylorfrancis.com/books/9781315364926
_zClick here to view.
942 _cEBK
999 _c72292
_d72292