000 04314nam a2201105 i 4500
001 5426840
003 IEEE
005 20220712205736.0
006 m o d
007 cr |n|||||||||
008 151221s2010 njua ob 001 eng d
010 _z 2003041102 (print)
020 _a9780471722939
_qelectronic
020 _a0471722936
020 _z9780471244318
_qprint
024 7 _a10.1002/9780471722939
_2doi
035 _a(CaBNVSL)mat05426840
035 _a(IDAMS)0b000064811f50b7
040 _aCaBNVSL
_beng
_erda
_cCaBNVSL
_dCaBNVSL
050 4 _aTK7874
_b.I47145 2003eb
082 0 4 _a621.3815
_222
245 0 0 _aIntegrated passive component technology /
_cedited by Richard K. Ulrich, Leonard W. Schaper.
264 1 _aPiscataway, New Jersey :
_bIEEE Press,
_cc2003.
264 2 _a[Piscataqay, New Jersey] :
_bIEEE Xplore,
_c[2010]
300 _a1 PDF (xix, 379 pages) :
_billustrations.
336 _atext
_2rdacontent
337 _aelectronic
_2isbdmedia
338 _aonline resource
_2rdacarrier
504 _aIncludes bibliographical references and index.
505 0 _aCharacteristics and performance of planar resistors ; Integrated resistor materials and processes ; Dielectric materials for integrated capacitors ; Size and configuration of integrated capacitors ; Processing integrated capacitors ; Defects and yield issues / Richard K. Ulrich -- Electrical performance of integrated capacitors / Richard K. Ulrich, Leonard W. Schaper --
506 1 _aRestricted to subscribers or individual electronic text purchasers.
520 _a. This is a thorough survey of the state-of-the-art in Integrated Passive Component Technology.. Describes the processes available for creating integrated passives, measuring their properties, and applying them.. Brings reader up to date in a fast-moving technology.. Enables reader to implement the technology into a manufacturing environment.. Covers existing and potential technologies for various substrate systems such as FR4, ceramic, and HDI.. Describes applications favorable to integrated passives and the economic tradeoffs associated with their implementation.
530 _aAlso available in print.
538 _aMode of access: World Wide Web
588 _aDescription based on PDF viewed 12/21/2015.
650 0 _aPassive components.
_927421
650 0 _aIntegrated circuits
_xDesign and construction.
_97630
650 0 _aPrinted circuits
_xDesign and construction.
_93994
655 0 _aElectronic books.
_93294
695 _aAssembly
695 _aBiographies
695 _aBiological system modeling
695 _aBooks
695 _aCapacitance
695 _aCapacitors
695 _aCellular phones
695 _aCeramics
695 _aClocks
695 _aComputers
695 _aConductivity
695 _aConductors
695 _aCopper
695 _aCrystals
695 _aDensity measurement
695 _aDielectric constant
695 _aDielectric materials
695 _aEconomics
695 _aFabrication
695 _aFilms
695 _aFlexible printed circuits
695 _aImpedance
695 _aIndexes
695 _aInductance
695 _aInductors
695 _aIntegrated circuit modeling
695 _aIntegrated circuits
695 _aLayout
695 _aLead
695 _aMagnetic fields
695 _aMaterials
695 _aMathematical model
695 _aMetals
695 _aMicrostrip
695 _aMicrowave integrated circuits
695 _aPower distribution
695 _aPower supplies
695 _aResistance
695 _aResistors
695 _aRouting
695 _aSilicon
695 _aSpirals
695 _aSputtering
695 _aStrips
695 _aSubstrates
695 _aSurface treatment
695 _aTemperature distribution
695 _aThroughput
700 1 _aSchaper, Leonard W.
_927422
700 1 _aUlrich, Richard K.
_q(Richard Kevin),
_d1955-
_926555
710 2 _aJohn Wiley & Sons,
_epublisher.
_96902
710 2 _aIEEE Xplore (Online service),
_edistributor.
_927423
776 0 8 _iPrint version:
_z9780471244318
856 4 2 _3Abstract with links to resource
_uhttps://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5426840
942 _cEBK
999 _c74059
_d74059