000 | 03440nam a22005055i 4500 | ||
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001 | 978-3-030-15085-3 | ||
003 | DE-He213 | ||
005 | 20220801213556.0 | ||
007 | cr nn 008mamaa | ||
008 | 190807s2020 sz | s |||| 0|eng d | ||
020 |
_a9783030150853 _9978-3-030-15085-3 |
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024 | 7 |
_a10.1007/978-3-030-15085-3 _2doi |
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_aTJFC _2bicssc |
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_a621.3815 _223 |
100 | 1 |
_aEl-Kareh, Badih. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _932960 |
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245 | 1 | 0 |
_aSilicon Analog Components _h[electronic resource] : _bDevice Design, Process Integration, Characterization, and Reliability / _cby Badih El-Kareh, Lou N. Hutter. |
250 | _a2nd ed. 2020. | ||
264 | 1 |
_aCham : _bSpringer International Publishing : _bImprint: Springer, _c2020. |
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300 |
_aXLIX, 648 p. 473 illus., 272 illus. in color. _bonline resource. |
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336 |
_atext _btxt _2rdacontent |
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337 |
_acomputer _bc _2rdamedia |
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338 |
_aonline resource _bcr _2rdacarrier |
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347 |
_atext file _bPDF _2rda |
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505 | 0 | _aThe World Is Analog -- Review of Single-Crystal Silicon Properties -- PN Junctions -- Rectifying and Ohmic Contacts -- Bipolar and Junction Field-Effect Transistors -- Analog/RF CMOS -- High-Voltage and Power Transistors -- Passive Components -- Process Integration -- Mismatch and Noise -- Chip Reliability. | |
520 | _aThis book covers modern analog components, their characteristics, and interactions with process parameters. It serves as a comprehensive guide, addressing both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. Based on the authors’ extensive experience in the development of analog devices, this book is intended for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science. Enables engineers to understand analog device physics, and discusses important relations between process integration, device design, component characteristics, and reliability; Describes in step-by-step fashion the components that are used in analog designs, the particular characteristics of analog components, while comparing them to digital applications; Explains the second-order effects in analog devices, and trade-offs between these effects when designing components and developing an integrated process for their manufacturing. | ||
650 | 0 |
_aElectronic circuits. _919581 |
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650 | 0 |
_aOptical materials. _97729 |
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650 | 1 | 4 |
_aElectronic Circuits and Systems. _932961 |
650 | 2 | 4 |
_aOptical Materials. _97729 |
700 | 1 |
_aHutter, Lou N. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _932962 |
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710 | 2 |
_aSpringerLink (Online service) _932963 |
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773 | 0 | _tSpringer Nature eBook | |
776 | 0 | 8 |
_iPrinted edition: _z9783030150846 |
776 | 0 | 8 |
_iPrinted edition: _z9783030150860 |
776 | 0 | 8 |
_iPrinted edition: _z9783030150877 |
856 | 4 | 0 | _uhttps://doi.org/10.1007/978-3-030-15085-3 |
912 | _aZDB-2-ENG | ||
912 | _aZDB-2-SXE | ||
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