000 | 03987nam a22005535i 4500 | ||
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001 | 978-3-319-69395-8 | ||
003 | DE-He213 | ||
005 | 20220801213944.0 | ||
007 | cr nn 008mamaa | ||
008 | 180725s2019 sz | s |||| 0|eng d | ||
020 |
_a9783319693958 _9978-3-319-69395-8 |
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024 | 7 |
_a10.1007/978-3-319-69395-8 _2doi |
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050 | 4 | _aTA174 | |
072 | 7 |
_aTBD _2bicssc |
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072 | 7 |
_aTEC016020 _2bisacsh |
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_aTBD _2thema |
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082 | 0 | 4 |
_a620.0042 _223 |
100 | 1 |
_aSerksnis, Tony. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _935441 |
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245 | 1 | 0 |
_aDesigning Electronic Product Enclosures _h[electronic resource] / _cby Tony Serksnis. |
250 | _a1st ed. 2019. | ||
264 | 1 |
_aCham : _bSpringer International Publishing : _bImprint: Springer, _c2019. |
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300 |
_aXXI, 211 p. 56 illus., 25 illus. in color. _bonline resource. |
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336 |
_atext _btxt _2rdacontent |
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337 |
_acomputer _bc _2rdamedia |
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338 |
_aonline resource _bcr _2rdacarrier |
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347 |
_atext file _bPDF _2rda |
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505 | 0 | _aIntroduction and Author’s Credentials -- Outline of Text -- Successful Design -- Building the Design -- Structural Considerations. | |
520 | _aThis text explains the process of the design of product electronic enclosures. These products typically contain a printed circuit board. The text takes the reader from the original idea for a product, through the shipment in quantity to a customer. For the product enclosure designer, this proceeds through design layout, material selection, prototype building, testing, and ongoing design improvement. The book presents a substantive and lucid treatment of the structural, thermal, user-interface, assembly, quality control, and cost considerations of the product enclosure. Of special note is a discussion on the regulatory issues involved with the design of a product. A main thrust of the text is on the "commercialization" aspects of electronic products, that is, when an enclosure is needed for the product to meet environmental and certification requirements globally. The book targets the broadest audience tasked to design/manufacture an enclosure, from mechanical/industrial engineers to designers and technicians. While the intent of the text is not to provide a complete understanding of relevant physical phenomena addressed (strength of materials, shock and vibration, heat transfer), the book provides a ready reference on how and where these key properties may be considered in the design of most electronic enclosures. Elucidates successful enclosure design for electronic products, defining the design team and the definition of success Explains the processes for building enclosures, including printed circuit board layout (mechanical considerations) and optimal object placement, structural considerations, material selection, and user interface design Includes treatment of serviceability, product environments, standards and testing, cooling techniques as well as guidelines for Electromagnetic Compliance (EMC) standards and testing required to pass FCC/CE Reinforces design concepts presented with relevant solved problems. | ||
650 | 0 |
_aEngineering design. _93802 |
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650 | 0 |
_aManufactures. _931642 |
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650 | 0 |
_aThermodynamics. _93554 |
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650 | 0 |
_aHeat engineering. _95144 |
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650 | 0 |
_aHeat transfer. _932329 |
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650 | 0 |
_aMass transfer. _94272 |
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650 | 1 | 4 |
_aEngineering Design. _93802 |
650 | 2 | 4 |
_aMachines, Tools, Processes. _931645 |
650 | 2 | 4 |
_aEngineering Thermodynamics, Heat and Mass Transfer. _932330 |
710 | 2 |
_aSpringerLink (Online service) _935442 |
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773 | 0 | _tSpringer Nature eBook | |
776 | 0 | 8 |
_iPrinted edition: _z9783319693941 |
776 | 0 | 8 |
_iPrinted edition: _z9783319693965 |
776 | 0 | 8 |
_iPrinted edition: _z9783030098872 |
856 | 4 | 0 | _uhttps://doi.org/10.1007/978-3-319-69395-8 |
912 | _aZDB-2-ENG | ||
912 | _aZDB-2-SXE | ||
942 | _cEBK | ||
999 |
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