000 | 04107nam a22005655i 4500 | ||
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001 | 978-3-030-25201-4 | ||
003 | DE-He213 | ||
005 | 20220801214001.0 | ||
007 | cr nn 008mamaa | ||
008 | 190903s2020 sz | s |||| 0|eng d | ||
020 |
_a9783030252014 _9978-3-030-25201-4 |
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024 | 7 |
_a10.1007/978-3-030-25201-4 _2doi |
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050 | 4 | _aTA349-359 | |
072 | 7 |
_aTGMD _2bicssc |
|
072 | 7 |
_aSCI096000 _2bisacsh |
|
072 | 7 |
_aTGMD _2thema |
|
082 | 0 | 4 |
_a620.105 _223 |
100 | 1 |
_aChen, Zengtao. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _935612 |
|
245 | 1 | 0 |
_aAdvanced Thermal Stress Analysis of Smart Materials and Structures _h[electronic resource] / _cby Zengtao Chen, Abdolhamid Akbarzadeh. |
250 | _a1st ed. 2020. | ||
264 | 1 |
_aCham : _bSpringer International Publishing : _bImprint: Springer, _c2020. |
|
300 |
_aX, 304 p. 104 illus., 44 illus. in color. _bonline resource. |
||
336 |
_atext _btxt _2rdacontent |
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337 |
_acomputer _bc _2rdamedia |
||
338 |
_aonline resource _bcr _2rdacarrier |
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347 |
_atext file _bPDF _2rda |
||
490 | 1 |
_aStructural Integrity, _x2522-5618 ; _v10 |
|
505 | 0 | _aHeat conduction and moisture diffusion theories -- Basic Problems of Non-Fourier Heat Conduction -- Multiphysics of smart materials and structures -- Coupled thermal stresses in advanced and smart materials -- Thermal Fracture of Advanced Materials based on Fourier Heat Conduction -- Advanced thermal fracture analysis based on non-Fourier heat conduction models -- Future Perspectives. | |
520 | _aThis is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures. The book contains six chapters and starts with a brief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introduced through reviewing the methods for solving non-Fourier heat conduction theories and by presenting transient heat transport in representative homogeneous and advanced heterogeneous materials. The book provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry. A series of uncoupled thermal stress analyses on one-dimensional structures are also included. The volume ends with coupled thermal stress analyses of one-dimensional homogenous and heterogeneous smart piezoelectric structures considering different coupled thermopiezoelectric theories. Last but not least, fracture behavior of smart structures under thermal disturbance is investigated and the authors propose directions for future research on the topic of multiphysical analysis of smart materials. . | ||
650 | 0 |
_aMechanics, Applied. _93253 |
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650 | 0 |
_aSolids. _93750 |
|
650 | 0 |
_aMaterials—Analysis. _935613 |
|
650 | 0 |
_aMathematical models. _94632 |
|
650 | 1 | 4 |
_aSolid Mechanics. _931612 |
650 | 2 | 4 |
_aCharacterization and Analytical Technique. _935614 |
650 | 2 | 4 |
_aMathematical Modeling and Industrial Mathematics. _933097 |
700 | 1 |
_aAkbarzadeh, Abdolhamid. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _935615 |
|
710 | 2 |
_aSpringerLink (Online service) _935616 |
|
773 | 0 | _tSpringer Nature eBook | |
776 | 0 | 8 |
_iPrinted edition: _z9783030252007 |
776 | 0 | 8 |
_iPrinted edition: _z9783030252021 |
776 | 0 | 8 |
_iPrinted edition: _z9783030252038 |
830 | 0 |
_aStructural Integrity, _x2522-5618 ; _v10 _935617 |
|
856 | 4 | 0 | _uhttps://doi.org/10.1007/978-3-030-25201-4 |
912 | _aZDB-2-ENG | ||
912 | _aZDB-2-SXE | ||
942 | _cEBK | ||
999 |
_c75826 _d75826 |